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公开(公告)号:US20190115144A1
公开(公告)日:2019-04-18
申请号:US16152568
申请日:2018-10-05
Applicant: KOREA BASIC SCIENCE INSTITUTE
Inventor: Seung-young Park , Jungmin Jong Park
Abstract: The present invention relates to a bobbin and a coil assembly and electromagnet equipment including the same, and the electromagnet equipment, which includes a bobbin and a coil, includes a coil assembly receiving a refrigerant so as to remove heat produced when magnetic field lines are famed by an electric current running through the coil while the coil is wound on a center shaft relative to the center shaft provided on a center of the bobbin; and a terminal block provided on a lower side of the coil assembly, the terminal block supporting the coil assembly and receiving a refrigerant from outside and supplying the refrigerant to the coil assembly.
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2.
公开(公告)号:US11193988B2
公开(公告)日:2021-12-07
申请号:US16687213
申请日:2019-11-18
Applicant: KOREA RESEARCH INSTITUTE OF STANDARDS AND SCIENCE , KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY , KOREA BASIC SCIENCE INSTITUTE
Inventor: Kyoung-Woong Moon , Chan Yong Hwang , Byoung-Chul Min , Seung-young Park
Abstract: Provided is a method of measuring a magnitude of magnetization of a perpendicular magnetic thin film, including: forming a stripe pattern in which a first magnetic domain that extends in a y direction and is magnetized in a z direction and a second magnetic domain that extends in the y direction and is magnetized in a direction opposite to the z direction are arranged alternately in an x direction, in a perpendicular magnetic thin film that extends in an xy plane; changing widths in the x direction, of the first and second magnetic domains by applying a magnetic field having a predetermined magnitude, in the z direction, to the perpendicular magnetic thin film; and calculating an absolute value of the magnetization of the perpendicular magnetic thin film on the basis of a ratio between the widths in the x direction, of the first magnetic domain and the second magnetic domain.
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公开(公告)号:US20180364181A1
公开(公告)日:2018-12-20
申请号:US15974111
申请日:2018-05-08
Inventor: Seung-young Park , Sang-il Kim , Younghun Jo , Byoung-Chul Min
IPC: G01N22/02
Abstract: Disclosed is a wafer inspection apparatus. The wafer inspection apparatus includes: a magnetic field generating unit forming a magnetic field such that magnetic lines of force flow in a direction perpendicular or parallel to a first surface of a wafer on which a magnetic thin film is formed; a microwave guide unit emitting microwaves to a measurement region that is at least a partial region of the wafer and is a region affected by the magnetic field generated by the magnetic field generating unit; and a sensing unit receiving waves reflected or transmitted after the microwaves are emitted to the measurement region from the microwave guide unit.
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