公开(公告)号：US20200165275A1

公开(公告)日：2020-05-28

申请号：US16619464

申请日：2017-06-05

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

Inventor： Hyun-Aee CHUN ,  Yun-Ju KIM ,  Sook-Yeon PARK ,  Su-Jin PARK ,  Tae-Kwang KIM

IPC: C07F7/18 ,  C09J163/04 ,  C09D163/04 ,  C08L63/00 ,  C08G61/10

Abstract: The present invention relates to a novel compound having an alkoxysilyl group and an active ester group, a method for preparing the same, a composition comprising the same, and a use, wherein the novel compound exhibits improved low moisture absorption and/or low dielectric properties when cured as an epoxy composition, but is not accompanied by loss of thermal expansion characteristics. Disclosed are a novel compound of formulae AF to LF having an alkoxysilyl group and an active ester group, and a method for preparing the same, a composition comprising the same, and a use of same.