公开(公告)号：US20140311662A1

公开(公告)日：2014-10-23

申请号：US14194084

申请日：2014-02-28

Applicant: KOREA INSTITUTE OF MACHINERY & MATERIALS

Inventor： Jun-Hyuk CHOI ,  Eung-Sug LEE ,  Ji-Hye LEE ,  Jun-ho JEONG ,  Joo-Yun JUNG ,  Dae-Guen CHOI ,  Cheol-Hyeon KIM

IPC: B32B37/00

CPC classification number: G02B5/008 ,  B32B37/06 ,  B82Y20/00 ,  G09F3/10 ,  Y10T156/1031 ,  Y10T156/1041

Abstract: In a method for fabricating an embedded pattern using a transfer-based imprinting, an adhesive layer is formed on a substrate. The adhesive layer has a photo curable resin. A stamp having a protruded pattern is prepared. A thin-film layer is formed on an outer surface of the protruded pattern of the stamp. The stamp having the thin-film layer contact with the adhesive layer is pressed to selectively transfer the thin-film layer of the protruded pattern to the adhesive layer. Ultraviolet rays (UV) are irradiated to cure the adhesive layer. The stamp is removed.

Abstract translation: 在使用基于转印的压印制造嵌入图案的方法中，在基板上形成粘合剂层。 粘合剂层具有光固化树脂。 准备具有突出图案的印模。 在印模的突出图案的外表面上形成薄膜层。 按压具有与粘合剂层接触的薄膜层的印模以选择性地将突出图案的薄膜层转印到粘合剂层。 照射紫外线（UV）以固化粘合剂层。 邮票被删除。