公开(公告)号：US20020003137A1

公开(公告)日：2002-01-10

申请号：US09863685

申请日：2001-05-22

申请人： KYOCERA CORPORATION

发明人： Kiyoshi Yokoyama ,  Takafumi Turumaru ,  Hiroyuki Arima ,  Hideaki Shimozuru

IPC分类号： H05B003/00

CPC分类号： H05B1/00 ,  B23K3/0471 ,  H01L21/67103 ,  H01L24/81 ,  H01L2924/12042 ,  H01L2924/00

摘要： There is provided a bonding heater used to package a semiconductor chip on a multilayer substrate, which has adaptability to various chip sizes, with an excellent maintenance characteristics, with undesirable displacement of the chip at the time of mounting a semiconductor chip being made as small as possible and also with a temperature rise time to a desired temperature being shortened. This bonding heater is constituted by a ceramic tool for pressing an object to be heated, a ceramic heater for heating the tool, a heat insulating member for transferring heat generated by the ceramic heater mainly to the tool side and a holder for integrating these members and connecting these members to another member, and the tool, ceramic heater, heat insulating member and holder are detachably bonded.