公开(公告)号：US20240322193A1

公开(公告)日：2024-09-26

申请号：US18578087

申请日：2022-07-11

申请人： KYOCERA Corporation

发明人： Sasuke SHIRAMOMO ,  Kazuya IMANAKA

IPC分类号： H01M8/0232 ,  H01M8/0236 ,  H01M8/12 ,  H01M8/1253 ,  H01M8/126 ,  H01M8/2425

CPC分类号： H01M8/0232 ,  H01M8/0236 ,  H01M8/1253 ,  H01M8/126 ,  H01M8/2425 ,  H01M2008/1293 ,  H01M2300/0077

摘要： An electrochemical cell includes a gas permeable member, a metal member, and an electrically conductive member. The gas permeable member through which a reducing gas is permeable has electrical conductivity. The metal member contains chromium and is connected to the gas permeable member. The electrically conductive member is porous and is located between the gas permeable member and the metal member. The electrically conductive member contains metal particles, and a first element whose first ionization energy and free energy of formation of an oxide per mole of oxygen are smaller than those of chromium.

公开(公告)号：US20230223565A1

公开(公告)日：2023-07-13

申请号：US17916457

申请日：2021-04-09

申请人： KYOCERA CORPORATION

发明人： Kazuya IMANAKA ,  Fumito FURUUCHI ,  Sasuke SHIRAMOMO

IPC分类号： H01M8/0282 ,  H01M8/0273 ,  H01M8/0258

CPC分类号： H01M8/0282 ,  H01M8/0273 ,  H01M8/0258 ,  H01M2008/1293

摘要： A cell stack device includes cells, a metal member containing chromium, a covering layer, and a bonding material. The cells include a first cell and the cells includes respective element portions. The covering layer covers the metal member. The bonding material is positioned between the first cell and the covering layer. The cell stack device satisfies any one of (1) The covering layer includes at least two portions having different thicknesses or different surface roughnesses at different positions. (2) A surface roughness of the covering layer is different from that of the metal member. (3) At least one element selected from the group consisting of Mn, Ti, Ca, and Al is positioned at the interface between the metal member and the covering layer, and the content ratio of the at least one element at the interface is different from that of the metal member or the covering layer.