MICROELECTROMECHANICAL SYSTEM RESONATOR ASSEMBLY

    公开(公告)号:US20230133733A1

    公开(公告)日:2023-05-04

    申请号:US17918389

    申请日:2021-03-30

    IPC分类号: H03H9/24 H03H9/02

    摘要: A silicon microelectromechanical system, MEMS, resonator assembly, includes four flexural beam elements forming a rectangular frame, each beam element being connected at an end thereof to an end of a neighboring one of the beam elements. The resonator assembly further includes connection elements for connecting the rectangular frame to at least one mechanical anchor, and the resonator assembly supporting an in-plane flexural collective resonance mode.