公开(公告)号：US4774150A

公开(公告)日：1988-09-27

申请号：US22082

申请日：1987-03-05

申请人： Kagetaka Amano ,  Hiromitsu Takeda ,  Takao Suzuki ,  Masaaki Tamatani ,  Masayuki Itoh ,  Yoshikazu Takahashi

发明人： Kagetaka Amano ,  Hiromitsu Takeda ,  Takao Suzuki ,  Masaaki Tamatani ,  Masayuki Itoh ,  Yoshikazu Takahashi

IPC分类号： F01D5/28 ,  C23C4/02 ,  C23C4/10 ,  C23C30/00 ,  B32B9/00 ,  F01D25/00

CPC分类号： C23C4/02 ,  G01N2021/646 ,  Y10T428/12618

摘要： According to the present invention there is provided a thermal barrier coating wherein multilayers of (I) a ZrO.sub.2 layer containing a luminous activator and stabilized by Y.sub.2 O.sub.3, CaO, MgO or a mixture thereof and (II) a ZrO.sub.2 layer containing a luminous activator different from that used in (I) and stabilized by Y.sub.2 O.sub.3, CaO, MgO or a mixture thereof, or a ZrO.sub.2 layer not containing a luminous activator and stablized by Y.sub.2 O.sub.3 are stacked, and the layers at least under an uppermost layer opposite to a base member to be protected have a total thickness sufficient for exhibiting a thermal barrier effect. The present invention has as its object to provide a thermal barrier coating which allows non-destructive testing to determine whether it has a thickness sufficient for themal barrier effect.

摘要翻译： 根据本发明，提供了一种隔热涂层，其中（I）含有发光活化剂并由Y 2 O 3，CaO，MgO或其混合物稳定的ZrO 2层和（II）含有不同于 在（I）中使用并且由Y 2 O 3，CaO，MgO或其混合物或不含有发光活化剂并且由Y 2 O 3稳定的ZrO 2层稳定化的材料层叠，并且这些层至少在与基底材料相对的最上层 被保护的总厚度足以显示出热障效应。 本发明的目的是提供一种热障涂层，其允许非破坏性测试来确定其是否具有足以用于主要屏障效应的厚度。

公开(公告)号：US5004498A

公开(公告)日：1991-04-02

申请号：US419103

申请日：1989-10-10

申请人： Keizo Shimamura ,  Kagetaka Amano ,  Tatsuyoshi Aisaka ,  Satoshi Hanai ,  Kohsoku Nagata

发明人： Keizo Shimamura ,  Kagetaka Amano ,  Tatsuyoshi Aisaka ,  Satoshi Hanai ,  Kohsoku Nagata

IPC分类号： B23K35/22 ,  C22C1/10 ,  C22C32/00 ,  H01B1/02 ,  H01F6/06 ,  H01L39/14

CPC分类号： H01L39/14 ,  B23K35/222 ,  C22C1/10 ,  C22C32/0021 ,  H01B1/026 ,  H01F6/06 ,  Y10T428/12056

摘要： A dispersion strengthened copper alloy containing a copper matrix, and dispersion particles dispersed in the copper matrix within a range of 0.5 to 6 vol %. In this alloy, an average diameter of a matrix region where the dispersion particles are not present is 0.3 .mu.m or less, and the total amount of solid solution elements contained in the copper matrix is determined such that, when this amount of the solid solution elements is added to pure copper, the electric conductivity of the matrix is lowered by 5% IACS or less.

公开(公告)号：US4832707A

公开(公告)日：1989-05-23

申请号：US195868

申请日：1988-05-19

申请人： Hisato Kamohara ,  Kagetaka Amano ,  Hiromichi Horie ,  Keizo Shimamura ,  Tatsuyoshi Aisaka

发明人： Hisato Kamohara ,  Kagetaka Amano ,  Hiromichi Horie ,  Keizo Shimamura ,  Tatsuyoshi Aisaka

IPC分类号： C22C26/00

CPC分类号： C22C26/00

摘要： This invention provides a metal-bonded tool in which iron-base alloy powder and abrasive grains are bonded to each other. The quantity of the carbon or graphite in the bond being between 2.5 wt % or more and 4.5 wt % or less of the bond, and the diameter of the precipitated carbon or graphite being 5 .mu.m or less in the bond.