公开(公告)号：US20090026562A1

公开(公告)日：2009-01-29

申请号：US11878762

申请日：2007-07-26

申请人： Kai-Chih Wang ,  Fang-Chang Liu ,  I-Pang Chou

发明人： Kai-Chih Wang ,  Fang-Chang Liu ,  I-Pang Chou

IPC分类号： H01L31/00

CPC分类号： H01L27/14636 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

摘要： A package structure for an optoelectronic device. The package structure comprises a device chip interposed between a lower transparent substrate and an upper transparent substrate. The device chip comprises a semiconductor substrate comprising a device region surrounded by a pad region, in which the pad region comprises a plurality of notches along the edges of the semiconductor substrate. A dielectric layer is between the semiconductor substrate and the upper transparent substrate, comprising a plurality of pads formed therein and substantially aligned with the plurality of notches, respectively. A plurality of metal lines is disposed under a bottom surface of the lower transparent substrate. A plurality of solder balls disposed under the plurality of metal lines, respectively.

摘要翻译： 光电器件的封装结构。 封装结构包括插入在下透明基板和上透明基板之间的器件芯片。 器件芯片包括半导体衬底，该半导体衬底包括由焊盘区域围绕的器件区域，其中焊盘区域包括沿着半导体衬底的边缘的多个凹口。 电介质层位于半导体衬底和上部透明衬底之间，包括分别形成在其中并与多个凹口基本对准的多个焊盘。 多个金属线设置在下透明基板的底表面下方。 分别设置在多个金属线下方的多个焊球。