METHOD OF MEASURING PATTERN SHAPE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND PROCESS CONTROL SYSTEM
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    发明申请
    METHOD OF MEASURING PATTERN SHAPE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND PROCESS CONTROL SYSTEM 有权
    测量图形的方法,制造半导体器件的方法和工艺控制系统

    公开(公告)号:US20110020956A1

    公开(公告)日:2011-01-27

    申请号:US12823024

    申请日:2010-06-24

    IPC分类号: H01L21/66 G01B11/24

    摘要: A method of measuring a pattern shape of performing a shape measurement of a semiconductor pattern at a high accuracy even when a process margin is narrow with respect to miniaturization of a semiconductor device is provided. In the method of measuring a pattern shape, when a best-match calculated waveform cannot be selected, at least one parameter among shape parameters is set as a fixed value based on information obtained by another measurement apparatus that uses a measurement method independent to the pattern shape measurement, a matching of a library and a detected waveform is performed again, a best-match calculated waveform is selected, and shape information of an object pattern is obtained from the best-match calculated waveform.

    摘要翻译: 提供了即使当相对于半导体器件的小型化而处理裕度窄时,也可以高精度地测量执行半导体图案的形状测量的图案形状的方法。 在测定图案形状的方法中,当不能选择最佳匹配的计算波形时,基于使用独立于图案的测量方法的另一测量装置获得的信息,将形状参数中的至少一个参数设置为固定值 形状测量,再次执行库和检测波形的匹配,选择最佳匹配计算波形,并根据最佳匹配计算波形获得目标图形的形状信息。