公开(公告)号：US06280306B1

公开(公告)日：2001-08-28

申请号：US09497854

申请日：2000-02-04

申请人： Kanji Hosoki ,  Hiroshi Shibaya ,  Masahito Komasaki ,  Jiro Sano ,  Kazuo Iizuka

发明人： Kanji Hosoki ,  Hiroshi Shibaya ,  Masahito Komasaki ,  Jiro Sano ,  Kazuo Iizuka

IPC分类号： B24B2900

CPC分类号： B24B37/30 ,  B24B37/32

摘要： The invention provides a wafer polishing apparatus and a wafer manufacturing method which can improve uniformity in polishing wafer surfaces. A wafer holding head comprises a head body; a diaphragm stretched inside the head body; a carrier fixed to the diaphragm to be displaceable in the direction of a head axis while holding the wafer; a retainer ring disposed around the carrier in concentric relation and fixed to the diaphragm to be displaceable in the direction of the head axis; and a thin plate disposed so as to project from the head body along a surface of the diaphragm. With the provision of the thin plate, an excessive pressing force acting upon the retainer ring from the diaphragm is suppressed, and the wafer surface can be prevented from being excessively polished at an outer peripheral edge.

摘要翻译： 本发明提供一种可以提高抛光晶片表面的均匀性的晶片抛光装置和晶片制造方法。 晶片保持头包括头体; 头部主体内部的隔膜; 固定在所述隔膜上的载体，以便在保持所述晶片的同时在头轴线的方向上移动; 保持环，其以同心关系设置在所述载体周围，并且固定到所述隔膜以能够沿所述头部轴线的方向移位; 以及薄板，其设置成沿着所述隔膜的表面从所述头本体突出。 通过设置薄板，可以抑制从隔膜作用在保持环上的过大的按压力，并且可以防止晶片表面在外周缘处被过度抛光。

公开(公告)号：US06302772B1

公开(公告)日：2001-10-16

申请号：US09538506

申请日：2000-03-30

申请人： Kanji Hosoki ,  Hiroshi Shibaya ,  Masahito Komasaki ,  Jiro Sano ,  Hiroyuki Kobayashi

发明人： Kanji Hosoki ,  Hiroshi Shibaya ,  Masahito Komasaki ,  Jiro Sano ,  Hiroyuki Kobayashi

IPC分类号： B24B100

CPC分类号： B24B53/017

摘要： An apparatus for dressing a wafer polishing pad, including a disk-shaped dresser, an arm, and a control unit. The disk-shaped dresser is configured to be pressed against the polishing pad which rotates in a circumferential direction. The dresser is configured to rotate in a same direction as the polishing pad rotates due to frictional force generated between the dresser and the polishing pad. The arm is configured to support the dresser rotatably and to press the dresser against the polishing pad. The control unit is configured to control the arm to position the dresser such that a peripheral edge portion of the dresser is positioned outside a peripheral edge portion of the polishing pad by a predetermined distance.

摘要翻译： 一种用于修整晶片抛光垫的装置，包括盘形修整器，臂和控制单元。 盘形修整器构造成被压靠在沿圆周方向旋转的抛光垫上。 修整器被配置成沿着抛光垫由于修整器和抛光垫之间产生的摩擦力而旋转的相同方向旋转。 臂被配置成可旋转地支撑修整器并将修整器压靠在抛光垫上。 控制单元被配置为控制臂以定位修整器，使得修整器的周缘部分位于抛光垫的周缘部分外部预定距离。

公开(公告)号：US06346038B1

公开(公告)日：2002-02-12

申请号：US09461329

申请日：1999-12-15

申请人： Jiro Kajiwara ,  Yoshie Kaido ,  Masahito Komasaki

发明人： Jiro Kajiwara ,  Yoshie Kaido ,  Masahito Komasaki

IPC分类号： B24B4702

CPC分类号： B24B37/345 ,  B08B3/02 ,  H01L21/68707

摘要： A wafer loading/unloading device and a method for producing wafers in which positioning and mounting can be effected in a stable manner when attaching the wafer to the polishing head and which make it possible to receive or transfer the polished wafer in a stable manner. The wafer loading/unloading device includes a main body portion for supporting a wafer W, a swinging shaft supporting a swinging arm connected to the main body portion, and an arm ascending/descending mechanism supporting the swinging arm such that it can ascend and descend. The main body portion is equipped with a wafer support portion and an action force absorbing mechanism for absorbing vertical force acting on the wafer support portion, so that the impact when attaching or detaching the wafer to or from the polishing head is mitigated. Thus, damage to the wafer and the polishing head is prevented and the wafer is transferred in a stable manner.

摘要翻译： 一种晶片装载/卸载装置以及用于生产晶片的方法，其中当将晶片附着在抛光头上时可以稳定地进行定位和安装，并且可以以稳定的方式接收或转移抛光的晶片。 晶片装载/卸载装置包括用于支撑晶片W的主体部分，支撑连接到主体部分的摆动臂的摆动轴和支撑摆臂的臂上升/下降机构，使其能够上升和下降。 主体部分配备有晶片支撑部分和用于吸收作用在晶片支撑部分上的垂直力的作用力吸收机构，从而减轻了将晶片连接到抛光头或从抛光头分离晶片的冲击。 因此，防止对晶片和抛光头的损坏，并且以稳定的方式转移晶片。