公开(公告)号：US06099939A

公开(公告)日：2000-08-08

申请号：US921453

申请日：1997-08-25

申请人： Kashmiri L. Mittal ,  Judith Marie Roldan ,  Carlos Juan Sambucetti ,  Ravi F. Saraf

发明人： Kashmiri L. Mittal ,  Judith Marie Roldan ,  Carlos Juan Sambucetti ,  Ravi F. Saraf

IPC分类号： C23C14/02 ,  H01L21/48 ,  H01L21/768 ,  H05K3/38 ,  B32B15/08

CPC分类号： C23C14/024 ,  H01L21/4864 ,  H05K3/381 ,  Y10T428/24355 ,  Y10T428/24521 ,  Y10T428/31678 ,  Y10T428/31681

摘要： Enhanced adhesion between a vapor deposited metal and an organic polymer surface is achieved without utilizing any intermediate surface preparatory steps. The morphology of the polymer surface is tailored to produce mounds and dimples on the surface which leads to a mechanically tougher, interdigitated metal/polymer interface. In the preferred embodiment, a solution of a solvent or solvent system and two or more polymer precursors or polymers or combinations thereof are cast in a film on a substrate and heated to spontaneously form a rough surface due to phase separation. The surface topography of such a film consists of characteristic mounds and dimples depending upon the composition of the solution. Direct metal vapor deposition onto the roughened surface results in an enhanced adhesion of the metal to the organic polymer surface. The organic polymer surface or substrate may be, but need not be, attached to yet another underlying substrate such as a ceramic (e.g., a silicon semiconductor chip), plastic or metal.

摘要翻译： 实现气相沉积金属与有机聚合物表面之间的增强粘附，而不用任何中间表面的准备步骤。 聚合物表面的形态被定制以在表面上产生墩和凹坑，这导致机械上更坚韧，交错的金属/聚合物界面。 在优选的实施方案中，将溶剂或溶剂体系和两种或更多种聚合物前体或聚合物或其组合的溶液浇铸在基材上的膜中，并由于相分离而加热以自发形成粗糙表面。 根据溶液的组成，这种薄膜的表面形貌由特征土丘和凹坑构成。 在粗糙化表面上的直接金属气相沉积导致金属对有机聚合物表面的附着力增强。 有机聚合物表面或衬底可以是但不必须附着到另一个下面的衬底，例如陶瓷（例如，硅半导体芯片），塑料或金属。