System and method for detecting defects on a structure-bearing surface using optical inspection
    1.
    发明授权
    System and method for detecting defects on a structure-bearing surface using optical inspection 有权
    使用光学检查检测结构轴承表面缺陷的系统和方法

    公开(公告)号:US06813376B1

    公开(公告)日:2004-11-02

    申请号:US09697807

    申请日:2000-10-27

    IPC分类号: G06K900

    摘要: A method of collating and using captured semiconductor-wafer image data in an automated defect analysis. The method includes the steps of receiving image data and, if necessary, converting it to a digital format. Once the data is in pixel-by-pixel form, each pixel is assigned a slope value derived from the direction of the structure edge, if any, on which it lies. The pixel-slope data is then evaluated to determine whether a photo-resist anomaly is present. The method may also include evaluated an average pixel slope value for each inspected wafer. Dependant claims further define the invention to claim an inspection system for employing the method.

    摘要翻译: 一种在自动化缺陷分析中整理和使用捕获的半导体晶片图像数据的方法。 该方法包括接收图像数据的步骤,如有必要,将其转换为数字格式。 一旦数据以像素为单位的形式,每个像素被分配一个从它所在的结构边缘(如果有的话)的方向导出的斜率值。 然后评估像素斜率数据以确定是否存在光刻胶异常。 该方法还可以包括评估每个被检查晶片的平均像素斜率值。 从属权利要求进一步限定本发明以要求用于采用该方法的检查系统。