公开(公告)号：US5102605A

公开(公告)日：1992-04-07

申请号：US747954

申请日：1991-08-21

Applicant: Katsuo Kagaya ,  Yoshifumi Hama ,  Shichinosuke Ito

Inventor： Katsuo Kagaya ,  Yoshifumi Hama ,  Shichinosuke Ito

IPC: C08F299/02

CPC classification number: C08F299/024 ,  Y10S525/921 ,  Y10S525/922

Abstract: A method of making a molded article by injecting into a mold filled with reinforcing material a resin composition including (a) 40 to 80% by weight of a resin including an oligomer having a number average molecular weight of 900 to 3,000 in terms of polystyrene equivalent obtained by gel permeation chromatography and having two or more terminal (meth)acrylate groups and an unsaturated polyester, and (b) 20 to 60% by weight of methyl (meth)acrylate monomer.

公开(公告)号：US5084508A

公开(公告)日：1992-01-28

申请号：US344613

申请日：1989-04-28

Applicant: Katsuo Kagaya ,  Yoshifumi Hama ,  Shichinosuke Ito

Inventor： Katsuo Kagaya ,  Yoshifumi Hama ,  Shichinosuke Ito

IPC: C08F299/02

CPC classification number: C08F299/024 ,  Y10S525/921 ,  Y10S525/922

Abstract: A resin composition comprising(a) 40 to 80% by weight of a resin comprisingan oligomer having a number average molecular weight of 900 to 3,000 in terms of polystyrene equivalent obtained by gel permeation chromatography and having two or more terminal (meth)acrylate groups andan unsaturated polyester, and(b) 20 to 60% by weight of methyl (meth)acrylate monomer.

公开(公告)号：US5098950A

公开(公告)日：1992-03-24

申请号：US480467

申请日：1990-02-15

Applicant: Katsuo Kagaya ,  Tadao Saito ,  Shichinosuke Ito

Inventor： Katsuo Kagaya ,  Tadao Saito ,  Shichinosuke Ito

IPC: C08F283/01 ,  C08F290/06 ,  C08F299/04 ,  C08L63/10 ,  C08L67/06 ,  C08L67/07

CPC classification number: C08L63/10 ,  C08L67/06

Abstract: Disclosed is a thermosetting resin composition which includes(a) an unsaturated polyester,(b) a polymer having a (meth)acrylate group only at one or both terminals of its main chain,(c) a poly(meth)acrylate oligomer,(d) a styrene monomer, and(e) a methyl methacrylate monomer.Also, a method of molding the resin is disclosed, which includes dividing the thermosetting resin composition into two parts, adding a curing agent to one of the two parts and a curing accelerator to another to form two partial compositions, introducing the two partial compositions into a mold, and allowing the two partial compositions to mix with each other and cure.