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公开(公告)号：US08853551B2
公开(公告)日：2014-10-07
申请号：US13067149
申请日：2011-05-12
CPC分类号： H05K1/118 , H05K1/147 , H05K2201/0338 , Y10T29/49162
摘要： A wired circuit board includes an insulating layer, and a first conductive pattern and a second conductive pattern formed on the insulating layer. The first conductive pattern includes a first outer terminal on which a metal plating layer is provided, a first inner terminal to be solder connected, and a first wire which connects the first outer terminal and the first inner terminal. The second conductive pattern includes a second outer terminal to be solder connected, a second inner terminal to be solder connected, and a second wire which connects the second outer terminal and the second inner terminal. The first inner terminal and the second inner terminal are arranged in opposed relation with each other so as to be solder connected to the common electric component and preflux processing is performed thereon, and a metal plating layer is provided on the second wire.
摘要翻译： 布线电路板包括绝缘层，以及形成在绝缘层上的第一导电图案和第二导电图案。 第一导电图案包括设置有金属镀层的第一外部端子，要被焊接的第一内部端子和连接第一外部端子和第一内部端子的第一导线。 第二导电图案包括要被焊接的第二外部端子，要被焊接的第二内部端子和连接第二外部端子和第二内部端子的第二导线。 第一内端子和第二内端子以彼此相对的关系布置，以便与公共电气部件焊接，并且在其上进行预过程处理，并且金属镀层设置在第二导线上。
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公开(公告)号：US20110284274A1
公开(公告)日：2011-11-24
申请号：US13067149
申请日：2011-05-12
CPC分类号： H05K1/118 , H05K1/147 , H05K2201/0338 , Y10T29/49162
摘要： A wired circuit board includes an insulating layer, and a first conductive pattern and a second conductive pattern formed on the insulating layer. The first conductive pattern includes a first outer terminal on which a metal plating layer is provided, a first inner terminal to be solder connected, and a first wire which connects the first outer terminal and the first inner terminal. The second conductive pattern includes a second outer terminal to be solder connected, a second inner terminal to be solder connected, and a second wire which connects the second outer terminal and the second inner terminal. The first inner terminal and the second inner terminal are arranged in opposed relation with each other so as to be solder connected to the common electric component and preflux processing is performed thereon, and a metal plating layer is provided on the second wire.
摘要翻译： 布线电路板包括绝缘层，以及形成在绝缘层上的第一导电图案和第二导电图案。 第一导电图案包括设置有金属镀层的第一外部端子，要被焊接的第一内部端子和连接第一外部端子和第一内部端子的第一导线。 第二导电图案包括要被焊接的第二外部端子，要被焊接的第二内部端子和连接第二外部端子和第二内部端子的第二导线。 第一内端子和第二内端子以彼此相对的关系布置，以便与公共电气部件焊接，并且在其上进行预过程处理，并且金属镀层设置在第二导线上。
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