公开(公告)号：US07757464B2

公开(公告)日：2010-07-20

申请号：US11096091

申请日：2005-04-01

申请人： Katsuyasu Hirata ,  Osamu Shimada ,  Kazuhiro Ohashi ,  Takayuki Iizuka ,  Hiroshi Shintani

发明人： Katsuyasu Hirata ,  Osamu Shimada ,  Kazuhiro Ohashi ,  Takayuki Iizuka ,  Hiroshi Shintani

IPC分类号： B65B11/50

CPC分类号： H05K13/0084

摘要： A method for manufacturing electronic or electric products such as flat-panel display devices, for coping with change or variations of dimensions of the products and for curbing damage or fracture on the products and reducing recovery cost for containers, according to one embodiment, comprising; sequentially placing first flat electronic or electric products as to be sandwiched by a resin-sheet band formed of one or pair of band-shaped flat resin sheet and as to be arrayed in a row; forming joined areas by bonding faces of the resin-sheet band as to form receptacles respectively for the first flat electronic or electric products; thus forming a band-shaped package; and then transporting or storing such array of the first flat electronic or electric products in the band-shaped package as to be used for producing second electronic or electric products.

摘要翻译： 根据一个实施例，一种用于制造诸如平板显示装置的电子或电气产品的方法，用于应对产品的尺寸变化或尺寸的变化以及用于抑制产品上的损坏或断裂并降低容器的回收成本。 顺序地将第一扁平电子产品或电气产品夹在由一个或一对带状扁平树脂片形成的树脂片带上并排列成一排; 通过粘合树脂片带的面来形成接合区域，以形成分别用于第一扁平电子产品或电气产品的插座; 从而形成带状包装; 然后将这种第一扁平电子产品或电气产品的阵列传送或存储在用于生产第二电子或电气产品的带状包装中。

公开(公告)号：US20050241988A1

公开(公告)日：2005-11-03

申请号：US11096091

申请日：2005-04-01

申请人： Katsuyasu Hirata ,  Osamu Shimada ,  Kazuhiro Ohashi ,  Takayuki Iizuka ,  Hiroshi Shintani

发明人： Katsuyasu Hirata ,  Osamu Shimada ,  Kazuhiro Ohashi ,  Takayuki Iizuka ,  Hiroshi Shintani

IPC分类号： B65D85/68 ,  B65B9/06 ,  B65B9/13 ,  B65B15/04 ,  B65B69/00 ,  B65D73/00 ,  B65D73/02 ,  B65D75/42 ,  B65D85/86 ,  G02F1/13 ,  H05K3/00 ,  H05K13/00

CPC分类号： H05K13/0084

摘要： A method for manufacturing electronic or electric products such as flat-panel display devices, for coping with change or variations of dimensions of the products and for curbing damage or fracture on the products and reducing recovery cost for containers, according to one embodiment, comprising; sequentially placing first flat electronic or electric products as to be sandwiched by a resin-sheet band formed of one or pair of band-shaped flat resin sheet and as to be arrayed in a row; forming joined areas by bonding faces of the resin-sheet band as to form receptacles respectively for the first flat electronic or electric products; thus forming a band-shaped package; and then transporting or storing such array of the first flat electronic or electric products in the band-shaped package as to be used for producing second electronic or electric products.

摘要翻译： 根据一个实施例，一种用于制造诸如平板显示装置的电子或电气产品的方法，用于应对产品的尺寸变化或尺寸的变化以及用于抑制产品上的损坏或断裂并降低容器的回收成本。 顺序地将第一扁平电子产品或电气产品夹在由一个或一对带状扁平树脂片形成的树脂片带上并排列成一排; 通过粘合树脂片带的面来形成接合区域，以形成分别用于第一扁平电子产品或电气产品的插座; 从而形成带状包装; 然后将这种第一扁平电子产品或电气产品的阵列传送或存储在用于生产第二电子或电气产品的带状包装中。

公开(公告)号：US06482892B1

公开(公告)日：2002-11-19

申请号：US09604099

申请日：2000-06-27

申请人： Seizo Katayama ,  Kazuo Kimura ,  Kazuhiro Ohashi ,  Minoru Horie

发明人： Seizo Katayama ,  Kazuo Kimura ,  Kazuhiro Ohashi ,  Minoru Horie

IPC分类号： C08L2302

CPC分类号： C08L23/02 ,  C08L21/00 ,  C08L23/08 ,  C08L23/0853 ,  C08L23/10 ,  C08L23/16 ,  C08L2207/04 ,  C08L2666/06 ,  C08L2666/04

摘要： An olefinic thermoplastic elastomer composition which does not exhibit problems due to a softening agent such as an oil is superior in molding processability. The thermoplastic elastomer composition is produced by a heat crosslinking process of a resin-rubber composition that contains an olefinic and/or diene rubber, an olefinic resin, and a vinyl copolymer. The vinyl copolymer is obtained by copolymerizing 20 wt % or more of a vinyl monomer represented by CH2═CHOCOR1 or CH2═CHOR2 wherein R1 and R2 are alkyl groups having 1-6 carbon atoms. The thermoplastic elastomer composition can include a vinyl copolymer that has not undergone a heat crosslinking process.

摘要翻译： 由于软化剂如油不会产生问题的烯烃类热塑性弹性体组合物，成型加工性优异。 热塑性弹性体组合物通过含有烯烃和/或二烯橡胶，烯烃树脂和乙烯基共聚物的树脂 - 橡胶组合物的热交联方法制备。 乙烯基共聚物通过共聚20重量％以上由CH2 = CHOCOR1或CH2 = CHOR2表示的乙烯基单体，其中R1和R2是具有1-6个碳原子的烷基。 热塑性弹性体组合物可以包括未经历热交联过程的乙烯基共聚物。