公开(公告)号：US20110107894A1

公开(公告)日：2011-05-12

申请号：US12995011

申请日：2009-04-27

申请人： Kazuya Maekawa ,  Ryota Sakaguchi ,  Tomoki Nakagaki

发明人： Kazuya Maekawa ,  Ryota Sakaguchi ,  Tomoki Nakagaki

IPC分类号： B26D3/02

CPC分类号： B28D1/225 ,  B24B9/10 ,  C03B33/023 ,  C03B33/033 ,  C03B33/09 ,  C03B33/091 ,  C03B33/105 ,  C03B33/107 ,  Y10T83/0259

摘要： [Issue] A chamfering method is provided that can be conducted even in small worksite space without using grinding members and without requiring a cleaning process after a chamfering process.[Resolution Means] A brittle material substrate chamfering method according to the present invention includes steps of drawing a scribing line, and heating and/or cooling a part in proximity to the scribing line. The scribing line is drawn on a part of a surface of a brittle material substrate that extends along the edge of the brittle material substrate and has a width not more than 50% of the thickness of the brittle material substrate starting from the edge of the brittle material substrate whereby forming a crack inclined from the surface of the substrate toward a side end surface of the substrate. A part in proximity to the scribing line is heated and/or cooled so that a corner part of the edge of said brittle material substrate is cut out whereby chamfering said brittle material substrate. In the step of drawing a scribing line on the part of a surface of a brittle material substrate, a cutter wheel is preferably used that has a plurality of inclined grooves along the circumferential edge line as cutting edge. The inclined grooves are inclined at a predetermined angle relative to the axial direction of the cutter wheel.

摘要翻译： [问题]提供了一种即使在小型工地空间中也可以进行倒角的方法，而不使用研磨构件，并且在倒角加工之后不需要清洁处理。 [分辨率方法]根据本发明的脆性材料基板倒角方法包括绘制划线，并且对靠近划线的部件进行加热和/或冷却的步骤。 划痕线被描绘在脆性材料基材的沿着脆性材料基材的边缘延伸的表面的一部分上，其宽度不大于脆性材料基材厚度的50％，从脆性材料的边缘开始 从而形成从基板的表面朝向基板的侧端面倾斜的裂纹。 加热和/或冷却与划刻线相邻的部分，从而切割所述脆性材料基材的边缘的角部，由此对所述脆性材料基板进行倒角。 在脆性材料基板的表面部分划线的步骤中，优选使用具有沿周缘边缘线的多个倾斜槽作为切削刃的切割轮。 倾斜槽相对于切割轮的轴向以预定的角度倾斜。