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    METHOD OF AND APPARATUS FOR DIVIDING PLATE MEMBER MADE OF BRITTLE MATERIAL
    3.
    发明申请
    METHOD OF AND APPARATUS FOR DIVIDING PLATE MEMBER MADE OF BRITTLE MATERIAL 审中-公开
    方法和装置用于分割薄板材料的成员

    公开(公告)号：US20160151929A1

    公开(公告)日：2016-06-02

    申请号：US14902954

    申请日：2014-05-22

    申请人： KAWASAKI JUKOGYO KABUSHIKI KAISHA

    发明人： Osami OGUSHI ,  Takanori KIRITOSHI ,  Mutsuhiro NAKAZAWA ,  Keiji TSUJITA

    IPC分类号： B26F3/00 ,  B26F3/06 ,  C03B33/09 ,  B28D5/00

    CPC分类号： B26F3/002 ,  B26F3/06 ,  B28D1/225 ,  B28D5/0011 ,  B65G2249/045 ,  C03B33/033 ,  C03B33/09 ,  Y02P40/57

    摘要： A method of dividing a plate member made of a brittle material includes; first, forming a minute start point flaw 16 in a first main surface of a plate member on a division-planned line; then holding the first main surface of the plate member on a pair of lines; and thereafter, for example, bringing a dividing member, which heats up a second main surface of the plate member by contact heating, into contact with the second main surface of the plate member to generate a tensile thermal stress on the first main surface and applying bending force in a thickness direction of the plate member to the second main surface of the plate member, such that a tensile stress derived from the bending force and the tensile thermal stress are combined together. In this manner, the plate member is divided along the division-planned line.

    摘要翻译： 由脆性材料制成的板构件的分割方法包括： 首先，在划分线上的板状构件的第一主面上形成微小的起点缺陷16; 然后将板构件的第一主表面保持在一对线上; 此后，例如，通过接触加热使板构件的第二主表面加热的分隔构件与板构件的第二主表面接触，以在第一主表面上产生拉伸热应力并施加 使板构件的厚度方向向板构件的第二主面施加弯曲力，使得从弯曲力和拉伸热应力得到的拉伸应力结合在一起。 以这种方式，沿着划分线划分板构件。

    BRITTLE NON-METALLIC WORKPIECE WITH THROUGH HOLE AND METHOD FOR MAKING SAME
    5.
    发明申请
    BRITTLE NON-METALLIC WORKPIECE WITH THROUGH HOLE AND METHOD FOR MAKING SAME 有权
    具有通孔的微型非金属工件及其制造方法

    公开(公告)号：US20090162606A1

    公开(公告)日：2009-06-25

    申请号：US12145467

    申请日：2008-06-24

    申请人： MU-CHI HSU ,  VLADIMIR STEPANOVICH KONDRATENKO

    发明人： MU-CHI HSU ,  VLADIMIR STEPANOVICH KONDRATENKO

    IPC分类号： B32B3/10

    CPC分类号： C03B33/093 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/50 ,  B28D1/00 ,  B28D7/02 ,  C03B33/04 ,  C03B33/09 ,  C03B33/091 ,  C03B33/102 ,  Y10T83/041 ,  Y10T83/0414 ,  Y10T428/24273

    摘要： An exemplary brittle non-metallic workpiece (80) defines a through hole (82). An inner surface (822) for forming the though hole has no microcracks and burrs. A method for making a through hole in a brittle non-metallic substrate (50) is also provided. The method includes as follows: forming an enclosing sketched etch (66) engraved into a brittle non-metallic substrate with a given depth (H) from a surface of the brittle non-metallic substrate; placing a cooling object (74) on an excess portion (68) inside the enclosing sketched etch (66); and extending the enclosing sketched etch through the brittle non-metallic substrate.

    摘要翻译： 示例性的脆性非金属工件（80）限定通孔（82）。 用于形成通孔的内表面（822）没有微裂纹和毛刺。 还提供了一种用于在脆性非金属基底（50）中形成通孔的方法。 该方法包括如下：从脆性非金属基底的表面形成刻蚀到具有给定深度（H）的脆性非金属基底中的封闭草图蚀刻（66）; 将冷却对象（74）放置在封闭的草图蚀刻（66）内部的多余部分（68）上; 并且通过脆性非金属基底延伸封闭的草图蚀刻。

    Substrate dividing apparatus and method for dividing substrate
    7.
    发明申请
    Substrate dividing apparatus and method for dividing substrate 审中-公开
    基板分割装置及基板分割方法

    公开(公告)号：US20070164072A1

    公开(公告)日：2007-07-19

    申请号：US10544070

    申请日：2004-01-28

    申请人： Yoshitaka Nishio

    发明人： Yoshitaka Nishio

    IPC分类号： B26F3/00

    CPC分类号： C03B33/107 ,  B28D5/0011 ,  C03B33/027 ,  C03B33/033 ,  C03B33/037 ,  C03B33/04 ,  C03B33/07 ,  C03B33/09 ,  C03B33/10 ,  Y10T225/304 ,  Y10T225/325

    摘要： A substrate cutting apparatus for cutting a substrate includes a scribe line forming means for forming a scribe line on a substrate and a breaking means for breaking the substrate along the scribe line. The breaking means includes means for spraying a heated fluid having a temperature sufficient to cause expansion of the substrate onto the scribe line formed so as to further extend a vertical crack extending from the scribe line in the thickness direction of the substrate.

    摘要翻译： 用于切割基板的基板切割装置包括用于在基板上形成划线的划线形成装置和用于沿着划线断开基板的断开装置。 断开装置包括用于喷射具有足以使基板膨胀到形成的划线上的温度的加热流体的装置，以便进一步延伸沿着基板的厚度方向从划线延伸的垂直裂纹。

    Method for cutting the edges of a continuous glass ribbon, a device for implementing said method, and a glass plate cut using said method
    8.
    发明授权
    Method for cutting the edges of a continuous glass ribbon, a device for implementing said method, and a glass plate cut using said method 有权
    用于切割连续玻璃带的边缘的方法，用于实现所述方法的装置以及使用所述方法切割的玻璃板

    公开(公告)号：US07128250B2

    公开(公告)日：2006-10-31

    申请号：US10466047

    申请日：2002-01-08

    申请人： Mauro Lucio Nascimento Luiz

    发明人： Mauro Lucio Nascimento Luiz

    IPC分类号： C03B33/03

    CPC分类号： C03B33/0235 ,  C03B33/033 ,  C03B33/09 ,  C03B33/091 ,  Y02P40/57 ,  Y10T83/0207 ,  Y10T83/0341 ,  Y10T83/0414 ,  Y10T225/10 ,  Y10T225/12 ,  Y10T225/304 ,  Y10T225/325

    摘要： A method for cutting the edges of a continuous glass ribbon (10), moving at a speed VR, comprising a longitudinal marking stage which generates a marking line, in particular using a cutting wheel (11), a transverse marking stage, and a subsequent transverse breaking stage. The inventive method also comprises an intermediary stage between the longitudinal marking stage and the transverse marking stage consisting in generating at least one longitudinal fissure (32) through at least a substantial part of the thickness of the continuous glass ribbon, or through the entire thickness of the continuous glass ribbon, on the basis of the marking line (30), and in spreading said longitudinal fissure at a speed VF, which is more or less equal to but in the opposite direction to the speed VR of the moving continuous glass ribbon. The invention also relates to a device designed to carry out said method. The glass plates cut using the inventive method have edges, advantageously, without any major defects.

    摘要翻译： 一种用于切割以速度VR移动的连续玻璃带（10）的边缘的方法，包括产生标记线的纵向标记台，特别是使用切割轮（11），横向标记台和随后的 横断面。 本发明的方法还包括在纵向标记阶段和横向标记阶段之间的中间阶段，其包括通过连续玻璃带的厚度的至少大部分产生至少一个纵向裂缝（32），或者通过整个厚度 连续的玻璃带，基于标记线（30），并且以与移动的连续玻璃带的速度VR相等但相反方向的速度VF扩展所述纵向裂缝。 本发明还涉及一种设计用于执行所述方法的装置。 使用本发明方法切割的玻璃板有边缘，有利地没有任何主要缺陷。

    Removal of enclosed glass parts after cutting using heating and cooling techniques
    10.
    发明授权
    Removal of enclosed glass parts after cutting using heating and cooling techniques 失效
    使用加热和冷却技术切割切割后的封闭玻璃部件

    公开(公告)号：US06829910B1

    公开(公告)日：2004-12-14

    申请号：US09558083

    申请日：2000-04-25

    申请人： John Hsieh ,  Robert M. Tierney

    发明人： John Hsieh ,  Robert M. Tierney

    IPC分类号： C03B33033

    CPC分类号： C03B33/09 ,  C03B33/04 ,  C03B33/091 ,  Y10T83/041 ,  Y10T83/0414

    摘要： A method for forming a magnetic disk comprises the following steps. First, an inner and outer cut is provided in a work piece. The waste piece thus comprises an outer waste piece, an inner waste piece, and a region between the inner and outer waste pieces that is to be used as a substrate for manufacturing a magnetic disk. The outer waste piece is separated from the substrate by applying a hot plate against the outer waste piece, thereby causing it to thermally expand and separate from the substrate. The substrate is then placed over (but not in contact with) a hot plate, while a cooling element is placed on the inner waste piece. This causes the substrate to thermally expand while the inner waste piece thermally contracts. Thus, a gap forms between the substrate and inner waste piece, thereby permitting the separation of the inner waste piece from the substrate.

    摘要翻译： 一种形成磁盘的方法包括以下步骤。 首先，在工件中设置内切割和外切割。 因此废弃物包括外部废料，内部废料，以及将用作制造磁盘的基材的内部和外部废料之间的区域。 通过向外部废件施加热板将外部废料与基材分离，从而使其与基材热膨胀和分离。 然后将基板放置在热板上（但不接触），同时将冷却元件放置在内部废料上。 这使得衬底在内部废物热收缩的同时热膨胀。 因此，在基板和内部废料之间形成间隙，从而允许内部废料与基板分离。