公开(公告)号：US06696909B2

公开(公告)日：2004-02-24

申请号：US09736062

申请日：2000-12-13

申请人： Keiji Inoue ,  Tsutomu Ishige ,  Yoshiteru Ohta

发明人： Keiji Inoue ,  Tsutomu Ishige ,  Yoshiteru Ohta

IPC分类号： H01F500

CPC分类号： H05K7/02 ,  H05K1/141 ,  H05K1/165 ,  H05K3/303 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2203/082

摘要： A circuit module has a circuit board on which electronic components are mounted and a covering member which has a plate portion and one or more supporting portions. The supporting portions fix the plate portion parallel to the surface of the circuit board. The covering member can be chucked by a chucking device to mount the circuit module to a mother circuit board.

摘要翻译： 电路模块具有安装有电子元件的电路板和具有板部分和一个或多个支撑部分的覆盖部件。 支撑部将平板部分平行于电路板的表面固定。 覆盖构件可以通过夹紧装置夹紧以将电路模块安装到母电路板。

公开(公告)号：US06633220B2

公开(公告)日：2003-10-14

申请号：US09885084

申请日：2001-06-20

申请人： Keiji Inoue ,  Tsutomu Ishige

发明人： Keiji Inoue ,  Tsutomu Ishige

IPC分类号： H01F500

CPC分类号： H01F27/2804 ,  H01F27/263

摘要： To prevent a substrate for mounting electronic components from being damaged when cores are rubbed together during assembly, a pair of core members sandwich a part of a coil pattern formed on the substrate from the top and bottom sides of the substrate, and the core members are held together by a core-combining member. A cover member is fixed to the substrate to cover the upper side of the core-combining member. Inclined ribs on the cover member raise the core-combining member by abutting against external inclined fates of leg portions of the core-combining member. A clearance thereby is formed between internal faces of a top bar portion of each core member and a surface of the substrate.

摘要翻译： 为了防止在组装期间将芯体摩擦在一起时，用于安装电子部件的基板被损坏，一对芯体从基板的顶面和底面夹着形成在基板上的线圈图案的一部分，并且芯部件 由核心组合成员共同组成。 盖构件固定到基板以覆盖芯组合构件的上侧。 盖构件上的倾斜肋通过抵靠芯组合构件的腿部的外倾斜位置而升高芯组合构件。 因此，在每个芯构件的顶部杆部的内表面和基板的表面之间形成间隙。

公开(公告)号：US5901031A

公开(公告)日：1999-05-04

申请号：US594771

申请日：1996-01-31

申请人： Tsutomu Ishige ,  Yasuhiro Negoro ,  Yuji Iyoda ,  Yasutaka Fujii ,  Katsuhiko Tanaka

发明人： Tsutomu Ishige ,  Yasuhiro Negoro ,  Yuji Iyoda ,  Yasutaka Fujii ,  Katsuhiko Tanaka

IPC分类号： H01G5/16 ,  H01G5/00

CPC分类号： H01G5/16

摘要： A reference electrode is fixed on the bottom of a concave portion of a substrate. A movable electrode is provided so that its electrode face faces that of the reference electrode at an interval to form a capacitor by the movable and reference electrodes. A driving electrode for driving the movable electrode is fixed on the substrate at an interval from the movable electrode. The distance 2L between the driving and movable electrodes is twice the distance L between the movable and reference electrodes. An external bias voltage is applied between the driving and movable electrodes to deflect the movable electrode. This doubles the range of the displacement of the movable electrode, thereby increasing the capacity change rate of the variable capacitor.

摘要翻译： 参考电极固定在基板的凹部的底部。 设置可动电极，使得其电极面与参考电极的电极表面间隔一定距离，以通过可移动和参考电极形成电容器。 用于驱动可动电极的驱动电极以可动电极的间隔固定在基板上。 驱动电极和可动电极之间的距离2L是可移动电极和参考电极之间的距离L的两倍。 在驱动电极和可动电极之间施加外部偏置电压以使可动电极偏转。 这使可动电极的位移范围翻倍，从而增加了可变电容器的容量变化率。