公开(公告)号：US07371143B2

公开(公告)日：2008-05-13

申请号：US10970319

申请日：2004-10-20

申请人： Keith J. Becken ,  Stephan L. Logunov ,  Kamjula P. Reddy ,  Joseph F. Schroeder, III ,  Holly J. Strzepek

发明人： Keith J. Becken ,  Stephan L. Logunov ,  Kamjula P. Reddy ,  Joseph F. Schroeder, III ,  Holly J. Strzepek

IPC分类号： H01J9/26

CPC分类号： C03C27/06 ,  H01L51/5246 ,  Y10T428/23 ,  Y10T428/24777

摘要： A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein. In one embodiment, the hermetically sealed glass package is suitable to protect thin film devices which are sensitive to the ambient environment. Some examples of such glass packages are organic emitting light diode (OLED) displays, sensors, and other optical devices. The present invention is demonstrated using an OLED display as an example.

摘要翻译： 本文描述了一种气密密封的玻璃封装及其制造方法。 在一个实施例中，密封玻璃封装适合于保护对环境环境敏感的薄膜器件。 这种玻璃封装的一些实例是有机发光二极管（OLED）显示器，传感器和其它光学器件。 以OLED显示器为例进行了说明。

公开(公告)号：US20080182062A1

公开(公告)日：2008-07-31

申请号：US12080003

申请日：2008-03-31

申请人： Keith J. Becken ,  Stephan L. Logunov ,  Kamjula P. Reddy ,  Joseph F. Schroeder ,  Holly J. Strzepek

发明人： Keith J. Becken ,  Stephan L. Logunov ,  Kamjula P. Reddy ,  Joseph F. Schroeder ,  Holly J. Strzepek

IPC分类号： B32B3/02 ,  B32B37/04 ,  B32B17/00

CPC分类号： C03C27/06 ,  H01L51/5246 ,  Y10T428/23 ,  Y10T428/24777

摘要： A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein. In one embodiment, the hermetically sealed glass package is suitable to protect thin film devices which are sensitive to the ambient environment. Some examples of such glass packages are organic emitting light diode (OLED) displays, sensors, and other optical devices. The present invention is demonstrated using an OLED display as an example.