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    Hermetically sealed glass package and method of fabrication
    3.
    发明授权
    Hermetically sealed glass package and method of fabrication 有权
    密封玻璃包装及其制造方法

    公开(公告)号：US08148179B2

    公开(公告)日：2012-04-03

    申请号：US12725648

    申请日：2010-03-17

    申请人： Bruce G. Aitken ,  Paul S. Danielson ,  James E. Dickinson, Jr. ,  Stephan L. Logunov ,  Robert Morena ,  Mark L. Powley ,  Kamjula P. Reddy ,  Joseph F. Schroeder, III ,  Alexander Streltsov

    发明人： Bruce G. Aitken ,  Paul S. Danielson ,  James E. Dickinson, Jr. ,  Stephan L. Logunov ,  Robert Morena ,  Mark L. Powley ,  Kamjula P. Reddy ,  Joseph F. Schroeder, III ,  Alexander Streltsov

    IPC分类号： H01L21/00

    CPC分类号： C03B23/245 ,  C03C3/091 ,  C03C3/093 ,  C03C3/108 ,  C03C8/04 ,  C03C8/10 ,  C03C8/24 ,  C03C27/06 ,  H01L51/524 ,  H01L51/5246

    摘要： A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. In one embodiment, the hermetically sealed glass package is manufactured by providing a first substrate plate and a second substrate plate. The second substrate contains at least one transition or rare earth metal such as iron, copper, vanadium, manganese, cobalt, nickel, chromium, neodymium and/or cerium. A sensitive thin-film device that needs protection is deposited onto the first substrate plate. A laser is then used to heat the doped second substrate plate in a manner that causes a portion of it to swell and form a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the thin film device. The second substrate plate is doped with at least one transition metal such that when the laser interacts with it there is an absorption of light from the laser in the second substrate plate, which leads to the formation of the hermetic seal while avoiding thermal damage to the thin-film device. Another embodiment of the hermetically sealed glass package and a method for manufacturing that hermetically sealed glass package are also described herein.

    摘要翻译： 这里使用OLED显示器作为示例来描述气密密封的玻璃封装和制造密封玻璃封装的方法。 在一个实施例中，通过提供第一基板和第二基板制造密封的玻璃封装。 第二基板包含至少一种过渡金属或稀土金属，例如铁，铜，钒，锰，钴，镍，铬，钕和/或铈。 需要保护的敏感薄膜器件沉积到第一衬底板上。 然后使用激光器以使其一部分膨胀并形成将第一衬底板连接到第二衬底板的气密密封件并且还保护薄膜器件的方式来加热掺杂的第二衬底板。 第二衬底板掺杂有至少一种过渡金属，使得当激光与其相互作用时，吸收来自第二衬底板中的激光的光，这导致气密密封的形成，同时避免对 薄膜装置。 本文还描述了密封玻璃封装的另一个实施例以及密封玻璃封装的制造方法。

    HERMETICALLY SEALED GLASS PACKAGE AND METHOD OF FABRICATION
    4.
    发明申请
    HERMETICALLY SEALED GLASS PACKAGE AND METHOD OF FABRICATION 有权
    密封玻璃包装和制造方法

    公开(公告)号：US20100186449A1

    公开(公告)日：2010-07-29

    申请号：US12725648

    申请日：2010-03-17

    申请人： Bruce G. Aitken ,  Paul S. Danielson ,  James E. Dickinson, JR. ,  Stephan L. Longunov ,  Robert Morena ,  Mark L. Powley ,  Kamjula P. Reddy ,  Joseph F. Schroeder, III ,  Alexander Streltsov

    发明人： Bruce G. Aitken ,  Paul S. Danielson ,  James E. Dickinson, JR. ,  Stephan L. Longunov ,  Robert Morena ,  Mark L. Powley ,  Kamjula P. Reddy ,  Joseph F. Schroeder, III ,  Alexander Streltsov

    IPC分类号： C03B29/00

    CPC分类号： C03B23/245 ,  C03C3/091 ,  C03C3/093 ,  C03C3/108 ,  C03C8/04 ,  C03C8/10 ,  C03C8/24 ,  C03C27/06 ,  H01L51/524 ,  H01L51/5246

    摘要： A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. In one embodiment, the hermetically sealed glass package is manufactured by providing a first substrate plate and a second substrate plate. The second substrate contains at least one transition or rare earth metal such as iron, copper, vanadium, manganese, cobalt, nickel, chromium, neodymium and/or cerium. A sensitive thin-film device that needs protection is deposited onto the first substrate plate. A laser is then used to heat the doped second substrate plate in a manner that causes a portion of it to swell and form a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the thin film device. The second substrate plate is doped with at least one transition metal such that when the laser interacts with it there is an absorption of light from the laser in the second substrate plate, which leads to the formation of the hermetic seal while avoiding thermal damage to the thin-film device. Another embodiment of the hermetically sealed glass package and a method for manufacturing that hermetically sealed glass package are also described herein.

    摘要翻译： 这里使用OLED显示器作为示例来描述气密密封的玻璃封装和制造密封玻璃封装的方法。 在一个实施例中，通过提供第一基板和第二基板制造密封的玻璃封装。 第二基板包含至少一种过渡金属或稀土金属，例如铁，铜，钒，锰，钴，镍，铬，钕和/或铈。 需要保护的敏感薄膜器件沉积到第一衬底板上。 然后使用激光器以使其一部分膨胀并形成将第一衬底板连接到第二衬底板的气密密封件并且还保护薄膜器件的方式来加热掺杂的第二衬底板。 第二衬底板掺杂有至少一种过渡金属，使得当激光与其相互作用时，吸收来自第二衬底板中的激光的光，这导致气密密封的形成，同时避免对 薄膜装置。 本文还描述了密封玻璃封装的另一个实施例以及密封玻璃封装的制造方法。

    Phosphate sealing frits with improved H2O durability
    8.
    发明授权
    Phosphate sealing frits with improved H2O durability 有权
    磷酸盐密封玻璃料具有改善的H2O耐久性

    公开(公告)号：US06737375B2

    公开(公告)日：2004-05-18

    申请号：US09810979

    申请日：2001-03-16

    申请人： Carol L. Buhrmaster ,  Robert Morena ,  Kamjula P. Reddy ,  Randall E. Youngman

    发明人： Carol L. Buhrmaster ,  Robert Morena ,  Kamjula P. Reddy ,  Randall E. Youngman

    IPC分类号： C03C319

    CPC分类号： G02B6/0218 ,  C03C3/19 ,  C03C8/08 ,  C03C8/24 ,  G02B6/02209 ,  G02B6/3628 ,  G02B6/4236

    摘要： Glass frit compositions, calculated in mole percent on an oxide basis, consisting essentially of 24.5 to 29.0% P2O5; 1.0 to 5.0% B2O3; 1.0 to 2.0% Al2O3; and sufficient amounts of SnO and ZnO (51.5 to 66.5% SnO, and 5.0-12.0% ZnO), wherein the molar ratio of SnO:ZnO is in the range of about 5.0:1 to 12:1, and 0.0 to 2.0% SiO2. The glass compositions exhibit, under NMR spectroscopic analysis of 11B nuclei, a signal containing at least two peaks at a chemical shift in the range of approximately −18 to −25 ppm. The frit compositions exhibit long term stability, durability, and resistance to attack against moisture in high temperature and humidity conditions and are capable of attaching optical fiber Bragg gratings without the use of a hermetic chamber and the like. An optoelectronic device that employs a sealing material that comprises a frit made from the glass compositions.

    摘要翻译： 基于氧化物计算的玻璃料组合物，其摩尔百分比基本上由24.5至29.0％的P2O5组成; 1.0〜5.0％B2O3; 1.0〜2.0％Al2O3; 和足够量的SnO和ZnO（51.5至66.5％SnO和5.0-12.0％ZnO），其中SnO：ZnO的摩尔比在约5.0:1至12:1的范围内，和0.0-2.0％的SiO 2 。 该玻璃组合物在<11> B核的NMR光谱分析下显示在大约-18至-25ppm的范围内含有化学位移的至少两个峰的信号。 玻璃料组合物在高温和高湿条件下表现出长期稳定性，耐久性和抗潮湿性，并且能够在不使用密封室等的情况下附接光纤布拉格光栅。 一种光电器件，其采用包含由玻璃组合物制成的玻璃料的密封材料。