TRANSFER DEVICE FOR HOLDING AN OBJECT USING A GAS FLOW
    2.
    发明申请
    TRANSFER DEVICE FOR HOLDING AN OBJECT USING A GAS FLOW 有权
    用于使用气体流动保持物体的传送装置

    公开(公告)号:US20140348624A1

    公开(公告)日:2014-11-27

    申请号:US14279699

    申请日:2014-05-16

    IPC分类号: B65G47/91 H01L21/683

    摘要: Disclosed is a transfer device for holding an object. The transfer device comprises: i) a housing having a housing surface; ii) at least one inlet conduit having an inlet for introducing a gas into the at least one inlet conduit; iii) a plurality of sets of outlet conduits, each set of outlet conduits being in fluid communication with the at least one inlet conduit and having a plurality of outlets for directing the gas out of the outlet conduits. In particular, the respective outlets of the sets of outlet conduits are arranged in a direction along the housing surface and away from a centre region relative to the respective sets of outlet conduits, so that a laminar gas flow that is flows along the housing surface generates a pressure differential which creates a force towards the centre region to hold the object against the housing surface. A gang picker is also disclosed.

    摘要翻译: 公开了一种用于保持物体的转印装置。 传送装置包括:i)具有壳体表面的壳体; ii)至少一个入口导管,其具有用于将气体引入至少一个入口导管的入口; iii)多组出口管道,每组出口导管与所述至少一个入口导管流体连通,并且具有多个用于将气体导出出口导管的出口。 特别地,出口导管组的相应出口沿着壳体表面的方向布置,并且相对于各组出口导管远离中心区域,使得沿壳体表面流动的层流气体产生 压力差产生朝向中心区域的力以将物体抵靠住壳体表面。 还公开了一个帮派选择者。

    MOLDING APPARATUS INCORPORATING PRESSURE UNIFORMITY ADJUSTMENT
    3.
    发明申请
    MOLDING APPARATUS INCORPORATING PRESSURE UNIFORMITY ADJUSTMENT 有权
    成型设备压力均匀调整

    公开(公告)号:US20090220629A1

    公开(公告)日:2009-09-03

    申请号:US12041140

    申请日:2008-03-03

    IPC分类号: B29C43/58

    摘要: A molding apparatus comprises first and second mold chases that are configured to clamp an electronic device therebetween, and a driving mechanism which drives the first and second mold chases to apply a clamping force onto the electronic device. A pressure adjustment mechanism communicates with at least one of the mold chases and applies an additional clamping pressure onto one or more portions of the mold chase. The pressure adjustment mechanism comprises movable supports that are displaceable in directions which are substantially perpendicular to the direction of the clamping force so as to transmit and apply the said additional clamping pressure onto the mold chase, and also a plurality of piezoelectric actuators which are operative to apply displacement forces to the movable supports in their displacement directions.

    摘要翻译: 模制设备包括构造成在其间夹住电子设备的第一和第二模具追逐器,以及驱动机构,其驱动第一模具追踪器和第二模具模具以将夹紧力施加到电子设备上。 压力调节机构与模具中的至少一个连通,并对模具追逐的一个或多个部分施加附加夹紧压力。 压力调节机构包括可移动的支撑件,其可在基本上垂直于夹紧力的方向上移动,以便将所述附加夹紧压力传递并施加到模具追踪上,并且还具有多个压电致动器, 在位移方向上向可动支架施加位移力。