摘要:
A main body of an apparatus for delivering shielding gas during wire bonding of an electronic device has a through-hole in the main body which is sized for allowing a capillary tip of a bonding tool to be insertable through the main body when performing wire bonding. At least one gas outlet located on a bottom surface of the main body adjacent to the through-hole is operative to direct an inert gas in a direction towards the electronic device. At least one gas inlet in the main body is operative to supply the inert gas to the through-hole and to the gas outlet.
摘要:
Disclosed is a transfer device for holding an object. The transfer device comprises: i) a housing having a housing surface; ii) at least one inlet conduit having an inlet for introducing a gas into the at least one inlet conduit; iii) a plurality of sets of outlet conduits, each set of outlet conduits being in fluid communication with the at least one inlet conduit and having a plurality of outlets for directing the gas out of the outlet conduits. In particular, the respective outlets of the sets of outlet conduits are arranged in a direction along the housing surface and away from a centre region relative to the respective sets of outlet conduits, so that a laminar gas flow that is flows along the housing surface generates a pressure differential which creates a force towards the centre region to hold the object against the housing surface. A gang picker is also disclosed.
摘要:
A molding apparatus comprises first and second mold chases that are configured to clamp an electronic device therebetween, and a driving mechanism which drives the first and second mold chases to apply a clamping force onto the electronic device. A pressure adjustment mechanism communicates with at least one of the mold chases and applies an additional clamping pressure onto one or more portions of the mold chase. The pressure adjustment mechanism comprises movable supports that are displaceable in directions which are substantially perpendicular to the direction of the clamping force so as to transmit and apply the said additional clamping pressure onto the mold chase, and also a plurality of piezoelectric actuators which are operative to apply displacement forces to the movable supports in their displacement directions.