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公开(公告)号:US20100236918A1
公开(公告)日:2010-09-23
申请号:US12681464
申请日:2008-09-29
申请人: Kenichi Imakita , Tadashi Morita , Hiroki Yamamoto , Naoki Morimoto , Ayao Nabeya , Shinya Nakamura
发明人: Kenichi Imakita , Tadashi Morita , Hiroki Yamamoto , Naoki Morimoto , Ayao Nabeya , Shinya Nakamura
CPC分类号: C23C14/3407 , C23C14/352 , H01J37/34 , H01J37/347 , H01L43/12
摘要: A film formation apparatus and film formation method that improve film thickness uniformity. A rotation mechanism holds a target having a sputtered surface in a state inclined relative to a surface of a substrate. The rotation mechanism rotatably supports the target about an axis extending along a normal of the sputtered surface. The target supported by the rotation mechanism is sputtered to form a thin film on the surface of the substrate. When forming the thin film, the rotation mechanism maintains the rotational angle of the target.
摘要翻译: 一种提高膜厚均匀性的成膜装置和成膜方法。 旋转机构将具有溅射表面的靶保持在相对于基板的表面倾斜的状态。 旋转机构围绕沿着溅射表面的法线延伸的轴线可旋转地支撑目标。 由旋转机构支撑的目标被溅射以在基板的表面上形成薄膜。 当形成薄膜时,旋转机构保持目标的旋转角度。
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公开(公告)号:US08702913B2
公开(公告)日:2014-04-22
申请号:US12681464
申请日:2008-09-29
申请人: Kenichi Imakita , Tadashi Morita , Hiroki Yamamoto , Naoki Morimoto , Ayao Nabeya , Shinya Nakamura
发明人: Kenichi Imakita , Tadashi Morita , Hiroki Yamamoto , Naoki Morimoto , Ayao Nabeya , Shinya Nakamura
IPC分类号: C23C14/34
CPC分类号: C23C14/3407 , C23C14/352 , H01J37/34 , H01J37/347 , H01L43/12
摘要: A film formation apparatus and film formation method that improve film thickness uniformity. A rotation mechanism holds a target having a sputtered surface in a state inclined relative to a surface of a substrate. The rotation mechanism rotatably supports the target about an axis extending along a normal of the sputtered surface. The target supported by the rotation mechanism is sputtered to form a thin film on the surface of the substrate. When forming the thin film, the rotation mechanism maintains the rotational angle of the target.
摘要翻译: 一种提高膜厚均匀性的成膜装置和成膜方法。 旋转机构将具有溅射表面的靶保持在相对于基板的表面倾斜的状态。 旋转机构围绕沿着溅射表面的法线延伸的轴线可旋转地支撑目标。 由旋转机构支撑的目标被溅射以在基板的表面上形成薄膜。 当形成薄膜时,旋转机构保持目标的旋转角度。
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