公开(公告)号：US08152594B2

公开(公告)日：2012-04-10

申请号：US12010738

申请日：2008-01-29

申请人： Kenichiro Saito ,  Osamu Nabeya ,  Kimihide Nagata ,  Tetsuji Togawa

发明人： Kenichiro Saito ,  Osamu Nabeya ,  Kimihide Nagata ,  Tetsuji Togawa

IPC分类号： B24B49/00

CPC分类号： B24B53/017 ,  B24B49/14 ,  B24B49/18

摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a top ring configured to hold and press the substrate against the polishing surface, a top ring shaft configured to lift and lower the top ring, and an elongation detecting device configured to detect an elongation of the top ring shaft. The polishing apparatus further includes a controller configured to set a vertical position of the top ring at the time of polishing, and control a lifting and lowering mechanism to lower the top ring to a preset polishing position as the set vertical position. The controller corrects the preset polishing position based on the elongation of the top ring shaft which has been detected by the elongation detecting device.

摘要翻译： 抛光装置用于将半导体晶片等基板研磨成平面镜面。 抛光装置包括具有抛光表面的抛光台，被配置为将基板保持并压靠在抛光表面上的顶环，构造成升高和降低顶环的顶环轴，以及延伸检测装置，其被配置为检测伸长率 的顶环轴。 抛光装置还包括控制器，其构造成在抛光时设置顶环的垂直位置，并且控制提升和降低机构以将顶环降低到作为设定垂直位置的预设抛光位置。 控制器基于由伸长检测装置检测到的顶环轴的伸长率来校正预设的抛光位置。

公开(公告)号：US20080287043A1

公开(公告)日：2008-11-20

申请号：US12010738

申请日：2008-01-29

申请人： Kenichiro Saito ,  Osamu Nabeya ,  Kimihide Nagata ,  Tetsuji Togawa

发明人： Kenichiro Saito ,  Osamu Nabeya ,  Kimihide Nagata ,  Tetsuji Togawa

IPC分类号： B24B29/00

CPC分类号： B24B53/017 ,  B24B49/14 ,  B24B49/18

摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a top ring configured to hold and press the substrate against the polishing surface, a top ring shaft configured to lift and lower the top ring, and an elongation detecting device configured to detect an elongation of the top ring shaft. The polishing apparatus further includes a controller configured to set a vertical position of the top ring at the time of polishing, and control a lifting and lowering mechanism to lower the top ring to a preset polishing position as the set vertical position. The controller corrects the preset polishing position based on the elongation of the top ring shaft which has been detected by the elongation detecting device.

摘要翻译： 抛光装置用于将半导体晶片等基板研磨成平面镜面。 抛光装置包括具有抛光表面的抛光台，被配置为将基板保持并压靠在抛光表面上的顶环，构造成升高和降低顶环的顶环轴，以及延伸检测装置，其被配置为检测伸长率 的顶环轴。 抛光装置还包括控制器，其构造成在抛光时设置顶环的垂直位置，并且控制提升和降低机构以将顶环降低到作为设定垂直位置的预设抛光位置。 控制器基于由伸长检测装置检测到的顶环轴的伸长率来校正预设的抛光位置。