Etching solution composition for metal thin film consisting primarily of copper
    1.
    发明授权
    Etching solution composition for metal thin film consisting primarily of copper 失效
    主要由铜组成的金属薄膜蚀刻溶液组成

    公开(公告)号:US08580136B2

    公开(公告)日:2013-11-12

    申请号:US13358226

    申请日:2012-01-25

    CPC分类号: C23F1/18

    摘要: The problem of the present invention is to provide an etching solution composition that can etch with high accuracy a metal-laminated film pattern comprising thin films of copper and a copper alloy, can form an excellent pattern shape, and has practically excellent and stable characteristics with long solution life, and to provide an etching method using such etching solution composition. The present invention relates to an etching method for etching a metal-laminated film having a layer consisting of copper and a layer consisting of a copper alloy containing copper, using an etching solution composition comprising phosphoric acid, nitric acid, acetic acid and water, as well as to said etching solution composition.

    摘要翻译: 本发明的问题是提供一种可以高精度地蚀刻包含铜和铜合金薄膜的金属层叠膜图案的蚀刻溶液组合物,可以形成优异的图案形状,并且具有实际上优异且稳定的特性, 长的溶液寿命,并提供使用这种蚀刻溶液组合物的蚀刻方法。 本发明涉及使用包含磷酸,硝酸,乙酸和水的蚀刻溶液组合物蚀刻具有由铜构成的层的金属层压膜和含有铜的铜合金的层的蚀刻方法,作为 以及所述蚀刻溶液组合物。

    ETCHING SOLUTION COMPOSITION FOR METAL THIN FILM CONSISTING PRIMARILY OF COPPER
    2.
    发明申请
    ETCHING SOLUTION COMPOSITION FOR METAL THIN FILM CONSISTING PRIMARILY OF COPPER 失效
    用于金属薄膜的蚀刻溶液组合物包括铜的主要成分

    公开(公告)号:US20120187087A1

    公开(公告)日:2012-07-26

    申请号:US13358226

    申请日:2012-01-25

    IPC分类号: C23F1/18 C09K13/06

    CPC分类号: C23F1/18

    摘要: The problem of the present invention is to provide an etching solution composition that can etch with high accuracy a metal-laminated film pattern comprising thin films of copper and a copper alloy, can form an excellent pattern shape, and has practically excellent and stable characteristics with long solution life, and to provide an etching method using such etching solution composition. The present invention relates to an etching method for etching a metal-laminated film having a layer consisting of copper and a layer consisting of a copper alloy containing copper, using an etching solution composition comprising phosphoric acid, nitric acid, acetic acid and water, as well as to said etching solution composition.

    摘要翻译: 本发明的问题是提供一种可以高精度地蚀刻包含铜和铜合金薄膜的金属层叠膜图案的蚀刻溶液组合物,可以形成优异的图案形状,并且具有实际上优异且稳定的特性, 长的溶液寿命,并提供使用这种蚀刻溶液组合物的蚀刻方法。 本发明涉及使用包含磷酸,硝酸,乙酸和水的蚀刻溶液组合物蚀刻具有由铜构成的层的金属层叠膜和由含铜的铜合金构成的层的蚀刻方法,作为 以及所述蚀刻溶液组合物。