公开(公告)号：US5217599A

公开(公告)日：1993-06-08

申请号：US790260

申请日：1991-11-08

申请人： Ker-Ming Chen ,  Syh-Ming Ho ,  Tsung-Hsiung Wang ,  Richard P. Cheng ,  Aina Hung

发明人： Ker-Ming Chen ,  Syh-Ming Ho ,  Tsung-Hsiung Wang ,  Richard P. Cheng ,  Aina Hung

IPC分类号： B32B15/08 ,  C25D3/02 ,  H05K1/03 ,  H05K3/38

CPC分类号： B32B15/08 ,  C25D3/02 ,  H05K1/0346 ,  H05K3/384 ,  H05K2201/0154 ,  H05K2201/0212 ,  H05K2201/0355 ,  H05K2201/2063 ,  H05K2203/0723

摘要： Disclosed is a method for electroplating a metal sheet adapted for being used in electronic packaging material, such as printed circuit boards. Bismaleimide and its derivative are added into the plated solution so as to form insoluble particles of bismaleimide and its derivatives on the surface of the metal sheet. The resulting metal sheet is particularly adapted for being bonded to a polyimide film for the preparation of, for example, a printed circuit board. Also disclosed is a method of bonding the metal sheet of the present invention to a polyimide substrate. Precursor of polyimide are coated on the surface of the plate metal sheet and then thermal imidizing of the precursors takes place. No additional adhesives are needed for this bonding.

摘要翻译： 公开了一种适用于电子封装材料如印刷电路板的金属片的电镀方法。 将双马来酰亚胺及其衍生物加入到镀液中，以在金属片的表面上形成双马来酰亚胺及其衍生物的不溶性颗粒。 所得到的金属片材特别适用于与用于制备例如印刷电路板的聚酰亚胺膜结合。 还公开了将本发明的金属板粘合到聚酰亚胺基板上的方法。 将聚酰亚胺的前体涂布在板金属片的表面上，然后进行前体的热亚胺化。 这种粘合不需要额外的粘合剂。