公开(公告)号：US20240334614A1

公开(公告)日：2024-10-03

申请号：US18740398

申请日：2024-06-11

Applicant: SOLUM CO., LTD.

Inventor： Jun Kyu Lee ,  Jeong Man Han ,  Su Young Kim ,  Yong Woo Kang ,  Sang Keun Ji ,  Dong Kyun Ryu

IPC: H05K3/28 ,  H05K1/02 ,  H05K13/00

CPC classification number: H05K3/284 ,  H05K1/0203 ,  H05K13/00 ,  H05K2201/0212 ,  H05K2203/1316

Abstract: The present invention relates to an electrical device including a printed circuit board (PCB) module accommodated in a case, and more particularly, to an electrical device having a heat dissipation structure using a filler that reduces heat generation outside a case while increasing a heat dissipation efficiency of a PCB module by using the filler filled in the case, and a manufacturing method of the same.

公开(公告)号：US20240268038A1

公开(公告)日：2024-08-08

申请号：US18434888

申请日：2024-02-07

Applicant: IBIDEN CO., LTD.

Inventor： Susumu KAGOHASHI ,  Jun SAKAI ,  Kyohei YOSHIKAWA

IPC: H05K3/46 ,  H05K1/03 ,  H05K1/09 ,  H05K3/40 ,  H05K3/42

CPC classification number: H05K3/4688 ,  H05K1/0306 ,  H05K1/0353 ,  H05K1/09 ,  H05K3/4038 ,  H05K3/423 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0323 ,  H05K2201/0326

Abstract: A printed wiring board includes a first conductor layer, a resin insulating layer including glass particles and resin, a second conductor layer formed on a surface of the resin insulating layer and including a seed layer and an electrolytic plating layer, and a via conductor connecting the first conductor layer and second conductor layer and including the seed layer and electrolytic plating layer extending from the second conductor layer. The second conductor layer and the via conductor are formed such that the second conductor layer includes signal wirings and that the seed layer is formed by sputtering an alloy including copper, aluminum, and one or more metals selected from nickel, zinc, gallium, silicon, and magnesium, and the resin insulating layer is formed such that the surface of the resin insulating layer includes the resin and that an inner wall surface in the opening includes the resin and the glass particles.

公开(公告)号：US12028985B2

公开(公告)日：2024-07-02

申请号：US17398277

申请日：2021-08-10

Applicant: SOLUM CO., LTD.

Inventor： Jun Kyu Lee ,  Jeong Man Han ,  Su Young Kim ,  Yong Woo Kang ,  Sang Keun Ji ,  Dong Kyun Ryu

IPC: H05K3/28 ,  H05K1/02 ,  H05K13/00

CPC classification number: H05K3/284 ,  H05K1/0203 ,  H05K13/00 ,  H05K2201/0212 ,  H05K2203/1316

Abstract: The present invention relates to an electrical device including a printed circuit board (PCB) module accommodated in a case, and more particularly, to an electrical device having a heat dissipation structure using a filler that reduces heat generation outside a case while increasing a heat dissipation efficiency of a PCB module by using the filler filled in the case, and a manufacturing method of the same.

公开(公告)号：US20240155778A1

公开(公告)日：2024-05-09

申请号：US18502605

申请日：2023-11-06

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Akihiro Takeuchi

IPC: H05K3/46

CPC classification number: H05K3/4688 ,  H05K2201/0212 ,  H05K2203/0369

Abstract: A wiring substrate includes a metal layer, a resin layer, and a wiring structure. The resin layer is laminated on the metal layer. The wiring structure includes a wiring layer and an insulating layer that are laminated on the resin layer, and in which the wiring layer is located by being brought into contact with the resin layer.

公开(公告)号：US20240147609A1

公开(公告)日：2024-05-02

申请号：US18410564

申请日：2024-01-11

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tomohiro FUKAO ,  Tomoaki SAWADA ,  Kyosuke MICHIGAMI ,  Qianying LI

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/12

CPC classification number: H05K1/0283 ,  H05K1/181 ,  H05K3/0058 ,  H05K3/0094 ,  H05K3/1283 ,  H05K2201/0212

Abstract: A method for manufacturing a stretchable circuit board includes preparing a laminate in which a metal layer and a first stretchable insulating layer are in contact with each other and a peel strength between the metal layer and the first stretchable insulating layer is 0.5 N/mm or more and 3.0 N/mm or less, a second stretchable insulating layer, and a fluid; forming a via leading from a first surface, in contact with the metal layer, of the first stretchable insulating layer to a second surface opposite to the first surface; filling the fluid in the via; laminating the second stretchable insulating layer on the second surface to seal the via; and patterning the metal layer.

公开(公告)号：US20240107685A1

公开(公告)日：2024-03-28

申请号：US18475288

申请日：2023-09-27

Applicant: IBIDEN CO., LTD.

Inventor： Susumu KAGOHASHI ,  Jun SAKAI ,  Kyohei YOSHIKAWA ,  Takuya INISHI

IPC: H05K3/46 ,  H05K1/03 ,  H05K1/11 ,  H05K3/06 ,  H05K3/16

CPC classification number: H05K3/4688 ,  H05K1/0306 ,  H05K1/0313 ,  H05K1/116 ,  H05K3/062 ,  H05K3/16 ,  H05K3/4608 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0338 ,  H05K2203/0369

Abstract: A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor including the seed layer and the electrolytic plating layer and connecting the first conductor and second conductor layers. The seed layer has a first portion on the surface of the insulating layer, a second portion on an inner wall surface in the opening of the insulating layer, and a third portion on a portion of the first conductor layer exposed by the opening of the insulating layer such that the first portion is thicker than the second portion and the third portion, the second portion has a first film and a second film electrically connected to the first film, and a portion of the first film is formed on the second film.

公开(公告)号：US20240074061A1

公开(公告)日：2024-02-29

申请号：US18271193

申请日：2022-01-18

Applicant: LG ENERGY SOLUTION, LTD.

Inventor： Sang Jin KIM ,  Young Joong KIM ,  Jin Hyun LEE ,  Dae Ho JUNG

IPC: H05K1/18 ,  H05K1/03

CPC classification number: H05K1/181 ,  H05K1/0306 ,  H05K2201/0212 ,  H05K2201/10037 ,  H05K2201/2054

Abstract: Discussed is a protection circuit module that may include a printed circuit board configured to be connected to a positive lead part and a negative lead part connected to a battery cell, wherein the printed circuit board includes an upper layer bonded to the positive lead part and the negative lead part so as to be electrically connected; an intermediate layer including a first insulating layer including a material containing an epoxy resin and provided below the upper layer; and a laser reflective layer provided between the upper layer and the first insulating layer and reflecting light from a laser.

公开(公告)号：US20230232540A1

公开(公告)日：2023-07-20

申请号：US17998966

申请日：2021-11-16

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. ,  MEC COMPANY LTD.

Inventor： Shoichiro SAKAI ,  Ryuta OHSUKA ,  Koji NITTA ,  Yoshihito YAMAGUCHI ,  Masaharu YASUDA ,  Akira TSUCHIKO ,  Koji KASUYA ,  Kenji NISHIE ,  Yu FUKUI

IPC: H05K3/10 ,  H05K3/12 ,  H05K1/03 ,  C22C19/05

CPC classification number: H05K3/103 ,  C22C19/05 ,  H05K1/0373 ,  H05K3/1258 ,  H05K2201/0212 ,  H05K2203/061 ,  H05K2203/176

Abstract: In manufacturing a printed circuit board using a semi-additive method, a removal liquid that has been used in removing a nickel-chromium-containing layer (5) is regenerated by contacting the removal liquid with a chelate resin having a functional group represented by a following formula (1) :





where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms may be substituted with halogen atoms.

公开(公告)号：US20230209729A1

公开(公告)日：2023-06-29

申请号：US18177461

申请日：2023-03-02

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Junichi NAKAMURA ,  Takeshi TAKAI ,  Yusuke KARASAWA ,  Yoshihisa KANBE ,  Shuhei MOMOSE ,  Toshiki SHIROTORI

IPC: H05K3/46 ,  H05K1/11

CPC classification number: H05K3/4661 ,  H05K1/115 ,  H05K2201/0212 ,  H05K2201/0959 ,  H05K2201/096

Abstract: A wiring board includes a core layer having a first through hole formed therein, a magnetic resin filled inside the first through hole, a second through hole formed in the magnetic resin, and a plating film covering an inner wall surface of the second through hole. The plating film includes an electroless plating film, and an electrolytic plating film. The electroless plating film makes direct contact with an inner wall surface of the second through hole.

公开(公告)号：US09850401B2

公开(公告)日：2017-12-26

申请号：US14561070

申请日：2014-12-04

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Chung-Ting Lai ,  Chih-Wei Lin

IPC: C09D179/08 ,  B32B27/08 ,  B32B27/20 ,  B32B27/28 ,  B32B27/32 ,  H05K1/03 ,  H05K3/38 ,  C08G73/10 ,  B32B38/00 ,  H05K3/02

CPC classification number: C09D179/08 ,  B32B27/08 ,  B32B27/20 ,  B32B27/281 ,  B32B27/322 ,  B32B2038/0016 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2311/00 ,  B32B2379/08 ,  B32B2457/08 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/1071 ,  H05K1/036 ,  H05K3/022 ,  H05K3/381 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0212 ,  Y10T428/2495 ,  Y10T428/254 ,  Y10T428/259 ,  Y10T428/31544 ,  C08L27/18 ,  C08L83/04 ,  C08K3/36

Abstract: A multilayered polyimide film includes a first polyimide layer containing fluorine-containing polymer particles and having a first surface and a second surface, and a second polyimide layer and a third polyimide layer respectively disposed on the first surface and the second surface. The second and the third polyimide layers contain organic silicon oxygen compound particles. The multilayered polyimide film has a coefficient of thermal expansion (CTE) between about 13 and about 30 ppm/° C.