公开(公告)号：US08420165B2

公开(公告)日：2013-04-16

申请号：US12601977

申请日：2008-05-28

申请人： Kimitaka Sato ,  Balachandran Jeyadevan ,  Kazuyuki Tohji

发明人： Kimitaka Sato ,  Balachandran Jeyadevan ,  Kazuyuki Tohji

IPC分类号： B05D7/00

CPC分类号： B22F1/0062 ,  B22F9/24 ,  B22F2998/00 ,  B22F1/0022

摘要： Provided is a method for producing a silver fine powder covered with an organic substance, which comprises a step of mixing (i) a dispersion of silver particles covered with a protective material X1 that comprises an organic compound having an unsaturated bond and having a molecular weight of from 150 to 1000 in a liquid organic medium A, (ii) a protective material X2 that comprises an organic compound of which the number of the carbon atoms constituting the carbon skeleton is smaller than that of the organic compound to constitute the protective material X1, and (iii) a liquid organic medium B of which the ability to dissolve the protective material X1 therein is higher than that of the liquid organic medium A, thereby promoting the dissolution of the protective material X1 in the liquid organic medium B and the adhesion of the protective material X2 to the surface of the silver particles. Accordingly, the invention provides an industrial, large-scale mass-production system for a silver fine powder covered with a protective material having a low molecular weight, of which the sintering temperature can be greatly lowered.

摘要翻译： 本发明提供一种覆盖有机物质的银细粉的制造方法，其特征在于，包括以下步骤：（i）由保护材料X1覆盖的银粒子的分散液，所述保护材料X1包含具有不饱和键的有机化合物，分子量 在液态有机介质A中为150〜1000，（ii）包含构成碳骨架的碳原子数小于构成保护材料X1的有机化合物的有机化合物的保护材料X2 ，和（iii）其中溶解保护材料X1的能力高于液体有机介质A的液体有机介质B，从而促进保护材料X1在液体有机介质B中的溶解和粘附 的保护材料X2到银颗粒的表面。 因此，本发明提供了一种用低分子量保护材料覆盖的银粉末的工业大规模批量生产系统，其烧结温度可以大大降低。

公开(公告)号：US20100279006A1

公开(公告)日：2010-11-04

申请号：US12601977

申请日：2008-05-28

申请人： Kimitaka Sato ,  Balachandran Jeyadevan ,  Kazuyuki Tohji

发明人： Kimitaka Sato ,  Balachandran Jeyadevan ,  Kazuyuki Tohji

IPC分类号： B05D7/00

CPC分类号： B22F1/0062 ,  B22F9/24 ,  B22F2998/00 ,  B22F1/0022

摘要： Provided is a method for producing a silver fine powder covered with an organic substance, which comprises a step of mixing (i) a dispersion of silver particles covered with a protective material X1 that comprises an organic compound having an unsaturated bond and having a molecular weight of from 150 to 1000 in a liquid organic medium A, (ii) a protective material X2 that comprises an organic compound of which the number of the carbon atoms constituting the carbon skeleton is smaller than that of the organic compound to constitute the protective material X1, and (iii) a liquid organic medium B of which the ability to dissolve the protective material X1 therein is higher than that of the liquid organic medium A, thereby promoting the dissolution of the protective material X1 in the liquid organic medium B and the adhesion of the protective material X2 to the surface of the silver particles. Accordingly, the invention provides an industrial, large-scale mass-production system for a silver fine powder covered with a protective material having a low molecular weight, of which the sintering temperature can be greatly lowered.

摘要翻译： 本发明提供一种覆盖有机物质的银细粉的制造方法，其特征在于，包括以下步骤：（i）由保护材料X1覆盖的银粒子的分散液，所述保护材料X1包含具有不饱和键的有机化合物，分子量 在液态有机介质A中为150〜1000，（ii）包含构成碳骨架的碳原子数小于构成保护材料X1的有机化合物的有机化合物的保护材料X2 ，和（iii）其中溶解保护材料X1的能力高于液体有机介质A的液体有机介质B，从而促进保护材料X1在液体有机介质B中的溶解和粘附 的保护材料X2到银颗粒的表面。 因此，本发明提供一种用低分子量保护材料覆盖的银粉末的工业化大规模生产系统，其烧结温度可以大大降低。