公开(公告)号：US10883614B2

公开(公告)日：2021-01-05

申请号：US16473651

申请日：2017-11-15

Applicant: Kitz SCT Corporation

Inventor： Chokuto Kou

IPC: F16K7/16 ,  F16K31/163 ,  F16K31/524

Abstract: Provided is a valve actuator in a simple structure and easily downsizable, having reliable valve openability and closability even under high pressure, and also capable of exerting high durability even with a high frequency of valve opening and closing, and a diaphragm valve including this valve actuator. In the valve actuator, a repulsive member provided in an actuator main body, a piston pressed by this repulsive member, and at least two air chambers for moving the piston by an air pressure are arranged and a booster mechanism for exerting a force amplified in a valve-closing direction is accommodated in any of the air chambers.

公开(公告)号：US11002372B2

公开(公告)日：2021-05-11

申请号：US16468344

申请日：2017-11-15

Applicant: Kitz SCT Corporation

Inventor： Chokuto Kou

IPC: F16K7/16 ,  F16K31/52 ,  F16K31/524

Abstract: A diaphragm valve includes a valve seat disposed in a valve chamber in a body, an annular groove provided on the outer periphery of the valve seat, a diaphragm provided so as to be able to make contact with and leave the valve seat via a pressurizing device, and a primary-side flow path communicating the valve chamber, in which an inner diameter of a secondary-side flow path contiguously provided to the annular groove is 2.0 to 4.5 times a groove width of the annular groove, and an intersection cross-sectional area between the annular groove and the secondary-side flow path is smaller than a cross-sectional area of the secondary-side flow path and the intersection cross-sectional area is configured to be equal to or larger than 35% with respect to a sectional area of the secondary-side flow path to acquire a predetermined Cv value.

公开(公告)号：US11047490B2

公开(公告)日：2021-06-29

申请号：US16097995

申请日：2017-08-17

Applicant: Kitz SCT Corporation

Inventor： Chokuto Kou

IPC: F16K7/00 ,  F16K7/14 ,  F16K7/12 ,  F16K31/60 ,  F16K31/06

Abstract: A diaphragm valve and a flow rate control device for a semiconductor manufacturing apparatus are configured so as to allow an increase of a valve flow rate while avoiding an increase in size of the valve. The diaphragm valve includes a diaphragm with an outer periphery being pressed and a valve seat part in a valve chamber of a body having an inflow path and an outflow path, with the diaphragm being configured to open and close the valve chamber by an ascending/descending motion of a stem. The diaphragm has a substantially-flat cross sectional form having a substantially-planar center region and a boundary region. The boundary region is on an outer peripheral side of the center region and has a radius of curvature smaller than that of the center region, and the boundary region is positioned near an outer peripheral side of the valve seat part.