Piezoelectric ceramic and manufacturing method thereof
    1.
    发明授权
    Piezoelectric ceramic and manufacturing method thereof 失效
    压电陶瓷及其制造方法

    公开(公告)号:US5965057A

    公开(公告)日:1999-10-12

    申请号:US726746

    申请日:1996-10-07

    摘要: There is provided a piezoelectric ceramic having a small mechanical factor of merit Qm and excellent heat-resisting properties, e.g., a piezoelectric ceramic for filter elements which is compatible with surface mounting and a method of manufacturing the same in a large amount and in a stable manner. There is provided a piezoelectric ceramic which is a composite oxide of at least lead, zirconium and titanium, wherein an oxide of manganese exists in a grain boundary layer in a density higher than that in a crystal grain of the piezoelectric ceramic and a glass phase exists in the grain boundary layer. It is manufactured by depositing a manganese compound and a glass material on the surface of a piezoelectric ceramic comprising a composite oxide of at least lead, zirconium and titanium and by performing thermal processing thereafter to diffuse the deposited substance in a grain boundary portion of the piezoelectric ceramic.

    摘要翻译: 提供了具有小的机械因数Qm和优异的耐热性能的压电陶瓷,例如与表面安装兼容的用于过滤元件的压电陶瓷及其制造方法大量且稳定的方法 方式。 提供了一种压电陶瓷,其是至少铅,锆和钛的复合氧化物,其中锰的氧化物以比压电陶瓷的晶粒中的密度高的晶界层存在并且存在玻璃相 在晶界层。 通过在包含至少铅,锆和钛的复合氧化物的压电陶瓷的表面上沉积锰化合物和玻璃材料,然后通过进行热处理,将沉积物扩散到压电体的晶界部分来制造 陶瓷。

    Piezoelectric ceramics and manufacturing method thereof
    2.
    发明授权
    Piezoelectric ceramics and manufacturing method thereof 失效
    压电陶瓷及其制造方法

    公开(公告)号:US5766502A

    公开(公告)日:1998-06-16

    申请号:US729733

    申请日:1996-10-07

    摘要: Piezoelectric ceramics whose mechanical quality factor Qm is small and which has an excellent heat resistance, e.g. piezoelectric ceramics for filtering elements whose group delay time characteristic is flat, phase distortion is small and which can be accommodated to surface mounting, and a method for stably producing it are provided. Manganese oxide and lead oxide are caused to coexist in high concentration in grain boundary parts of the piezoelectric ceramics containing composite oxides of at least lead, zirconium and titanium as compared to intra-crystal grains of the piezoelectric ceramics. It is manufactured by treating the piezoelectric ceramics by heat after adhering manganese and lead compounds on the surface thereof to diffuse the oxides in the grain boundary parts of the piezoelectric ceramics.

    摘要翻译: 压电陶瓷的机械品质因数Qm小,耐热性优异。 用于滤波元件的压电陶瓷,其组延迟时间特性平坦,相位变形小并且可以适应于表面安装,并且提供了一种用于稳定地生产它的方法。 与压电陶瓷的晶体内晶粒相比,含有至少铅,锆和钛的复合氧化物的压电陶瓷的晶界部分的高浓度氧化物和氧化铅共存。 通过在表面上附着锰和铅化合物之后通过热处理压电陶瓷来制造,以使氧化物在压电陶瓷的晶界部分扩散。

    Conductive paste
    3.
    发明授权
    Conductive paste 失效
    导电胶

    公开(公告)号:US5376596A

    公开(公告)日:1994-12-27

    申请号:US101921

    申请日:1993-08-04

    IPC分类号: C03C8/04 C03C8/18

    CPC分类号: C03C8/04 C03C8/18 Y10S428/901

    摘要: A conductive paste contains at least a conductive powder and a glass frit. The glass frit includes 9.0 to 45.0 wt % of SiO.sub.2 and 1.0 to 18.5 wt % of CaO, the balance being ZnO, B.sub.2 O.sub.3 and Li.sub.2 O. The glass frit may contain not more than 6.0 wt % of Al.sub.2 O.sub.3 incorporated therein as additive.

    摘要翻译: 导电浆料至少含有导电粉末和玻璃料。 玻璃料包含9.0〜45.0重量%的SiO 2和1.0〜18.5重量%的CaO,余量为ZnO,B 2 O 3和Li 2 O。 玻璃料可以含有不超过6.0重量%的掺入其中的Al 2 O 3作为添加剂。

    Soldered article
    5.
    发明授权
    Soldered article 有权
    焊接文章

    公开(公告)号:US06180264B2

    公开(公告)日:2001-01-30

    申请号:US09396819

    申请日:1999-09-14

    IPC分类号: B32B1501

    摘要: There is provided a soldered article comprising a component having a Cu conductor joined with a solder, wherein the solder comprises about 0.1 to 2.0% by weight of Cu, about 1.0 to 7.5% by weight of Bi, and the balance being Sn. By using the above described lead-free solder, the occurrence of leaching is suppressed during soldering, and the solderability and joining strength can be improved. Since the solder does not contain Ag, material cost can be reduced, thus enabling reductions in the cost of the entire soldered article.

    摘要翻译: 提供一种包含具有与焊料接合的Cu导体的部件的焊接制品,其中焊料包含约0.1至2.0重量%的Cu,约1.0至7.5重量%的Bi,余量为Sn。 通过使用上述无铅焊料,在焊接时抑制浸出的发生,可以提高可焊性和接合强度。 由于焊料不含有Ag,因此可以降低材料成本,从而能够降低整个焊接制品的成本。