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110 条记录 (耗时 0.03 秒)

    Superalloy material with improved weldability
    3.
    发明授权
    Superalloy material with improved weldability 有权
    具有改善焊接性能的超合金材料

    公开(公告)号：US06696176B2

    公开(公告)日：2004-02-24

    申请号：US10092326

    申请日：2002-03-06

    申请人： David B. Allen ,  Gregg P. Wagner ,  Brij B. Seth

    发明人： David B. Allen ,  Gregg P. Wagner ,  Brij B. Seth

    IPC分类号： B32B1501

    CPC分类号： C22C19/055 ,  B23K35/304 ,  B23K35/3046 ,  Y10T428/12931 ,  Y10T428/12937 ,  Y10T428/12944

    摘要： A fusion weldable superalloy containing 0.005-0.5 wt. % scandium. In one embodiment, the superalloy may have a composition similar to IN-939 alloy, but having added scandium and having only 0.005-0.040 wt. % zirconium. A gas turbine component may be formed by an investment casting of such a scandium-containing superalloy, and may include a fusion weld repaired area. A scandium-containing nickel-based superalloy coated with an MCrAlY bond coat will have improved cyclic oxidation resistance due to the sulfur-gettering effect of the scandium.

    摘要翻译： 一种熔融焊接的超合金，其含有0.005-0.5wt。 ％钪。 在一个实施方案中，超合金可以具有类似于IN-939合金的组成，但是添加钪并且仅具有0.005-0.040wt。 ％锆。 燃气轮机部件可以通过这种含钪的超级合金的熔模铸造形成，并且可以包括熔焊修补区域。 涂覆有MCrAlY粘合涂层的含钪镍基超合金由于钪的吸硫作用而具有改善的环氧化抗性。

    Arrangement for decreasing galvanic corrosion between metal components
    6.
    发明授权
    Arrangement for decreasing galvanic corrosion between metal components 失效
    用于减少金属部件之间电偶腐蚀的布置

    公开(公告)号：US06673469B2

    公开(公告)日：2004-01-06

    申请号：US09683441

    申请日：2001-12-28

    申请人： Malte Isaccsson ,  Henrik Hyttel ,  Thomas Hermansson ,  Stig Andersen ,  Kalsten Andersen ,  Mikael Fransson

    发明人： Malte Isaccsson ,  Henrik Hyttel ,  Thomas Hermansson ,  Stig Andersen ,  Kalsten Andersen ,  Mikael Fransson

    IPC分类号： B32B1501

    CPC分类号： F16B1/0071 ,  C23F15/00 ,  F16B33/008 ,  Y10S411/902 ,  Y10T428/12507 ,  Y10T428/12681 ,  Y10T428/12722 ,  Y10T428/12729 ,  Y10T428/12736 ,  Y10T428/12799

    摘要： Arrangement (1) for decreasing galvanic corrosion between metal components that includes at least a first component (2) in which a first metal is a part, and at least a second component (3) in which a second metal is a part, whereby the first metal has a higher normal-electrode potential (e0) than the second metal. The first component (2) is intended, after mounting, to be in electrical contact with the second component (3). The first component (2) is coated with a substantially continuous surface layer (4) that is adjusted to give the second component (3) an insignificant galvanic corrosion velocity after mounting. The invention is preferably applied in association with attachment elements such as bolt or screw joint reinforcements, which include a more noble metal than the component or the components with which the attachment element should be in contact with after mounting, and is particularly, preferred for vehicle components.

    摘要翻译： 用于减少至少包括第一金属部分的第一部件（2）和至少第二部件（3）的金属部件之间的电偶腐蚀的布置（1），其中第二金属是其中的一部分，由此 第一金属具有比第二金属高的正常电极电位（e <0）。 第一组件（2）旨在在安装之后与第二组件（3）电接触。 第一组分（2）涂覆有基本上连续的表面层（4），其被调节以使得第二组分（3）在安装之后具有不显着的电偶腐蚀速度。 本发明优选地与诸如螺栓或螺纹接头增强件的附接元件相关联，其包括比组件或附接元件在安装之后与其接触的部件更贵的金属，并且特别优选用于车辆 组件。

    Cooper clad laminate with cooper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with cooper-plated circuit layer
    7.
    发明授权
    Cooper clad laminate with cooper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with cooper-plated circuit layer 有权
    具有铜镀层电路层的Cooper覆层压板以及使用具有镀敷电路层的覆铜层压板制造印刷电路板的方法

    公开(公告)号：US06652993B2

    公开(公告)日：2003-11-25

    申请号：US10131222

    申请日：2002-04-25

    申请人： Takuya Yamamoto ,  Takashi Syoujiguchi

    发明人： Takuya Yamamoto ,  Takashi Syoujiguchi

    IPC分类号： B32B1501

    CPC分类号： H05K3/108 ,  H05K1/09 ,  H05K3/067 ,  H05K2201/0355 ,  Y10S428/901 ,  Y10T428/12535 ,  Y10T428/1291 ,  Y10T428/24917 ,  Y10T428/24942 ,  Y10T428/24983

    摘要： The object of the present invention is to provide a copper clad laminate with a copper-plated circuit layer, and a method for manufacturing a printed wiring board that excels the conventional ones in the aspect ratio of a circuit pattern when processed to a printed wiring board comprising a fine-pitch circuit. The object of the present invention is achieved by manufacturing a printed wiring board with the use of a copper clad laminate with a copper-plated circuit layer characterized by a copper-plated circuit layer and an outer-layer copper foil layer that satisfied the relationship in a case where a specific etchant is used, the R v value (Vsc/Vsp), which is the ratio of the dissolution rate (Vsp) of deposited copper that constitutes said copper-plated circuit layer to the dissolution rate (Vsc) of copper that constitutes said outer-layer copper foil layer, is 1.0 or more.

    摘要翻译： 本发明的目的是提供一种具有镀铜电路层的覆铜层压板，以及一种制造印刷线路板的方法，该印刷线路板在加工成印刷线路板时的电路图形的纵横比优于常规印刷电路板 包括精细间距电路。 本发明的目的是通过使用铜镀层压板制造印刷电路板，其特征在于镀铜电路层，其特征在于镀铜电路层和外层铜箔层，其满足以下关系： 使用特定蚀刻剂的情况，作为构成所述镀铜电路层的铜的溶解速度（Vsp）与铜的溶解速度（Vsc）的比的R v值（Vsc / Vsp） 构成所述外层铜箔层的面积为1.0以上。

    Leach-resistant solder alloys for silver-based thick-film conductors
    8.
    发明授权
    Leach-resistant solder alloys for silver-based thick-film conductors 有权
    用于银基厚膜导体的防漏焊料合金

    公开(公告)号：US06630251B1

    公开(公告)日：2003-10-07

    申请号：US10252502

    申请日：2002-09-23

    申请人： Bradley H. Carter ,  Shing Yeh

    发明人： Bradley H. Carter ,  Shing Yeh

    IPC分类号： B32B1501

    CPC分类号： C22C13/00 ,  B23K35/007 ,  B23K35/262 ,  B23K35/268 ,  B23K2101/36 ,  C22C11/00 ,  H05K1/092 ,  H05K3/3463 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/12896

    摘要： A tin-lead solder alloy containing copper and/or nickel and optionally silver, palladium, platinum and/or gold as its alloying constituents. The solder alloy consists essentially of, by weight, about 5% to about 70% tin, up to about 4% silver palladium, platinum and/or gold, about 0.5% to about 10% copper and/or nickel, the balance lead and incidental impurities. The presence of copper and/or nickel in the alloy has the beneficial effect of inhibiting the dissolution and leaching of silver from a silver-containing thick-film, such as a conductor or solder pad, into the molten solder alloy during reflow. In addition, solder joints formed of the solder alloy form a diffusion barrier layer of intermetallic compounds that inhibit solid-state interdiffusion between silver from a silver-containing thick-film and tin from the solder joint.

    摘要翻译： 含有铜和/或镍的锡铅焊料合金和任选的银，钯，铂和/或金作为其合金成分。 焊料合金基本上由重量计约5％至约70％的锡，至多约4％的银钯，铂和/或金，约0.5％至约10％的铜和/或镍，余量铅和 附带杂质。 合金中铜和/或镍的存在有利于在回流期间将银从含银厚膜（例如导体或焊盘）中溶解并浸出到熔融焊料合金中。 此外，由焊料合金形成的焊点形成金属间化合物的扩散阻挡层，其阻止来自含银厚膜的银与来自焊料接头的锡之间的固态相互扩散。

    Aluminum alloy brazing sheet for vacuum brazing exhibiting excellent corrosion resistance, and heat exchanger using the brazing sheet
    9.
    发明授权
    Aluminum alloy brazing sheet for vacuum brazing exhibiting excellent corrosion resistance, and heat exchanger using the brazing sheet 有权
    用于真空钎焊的优异的耐腐蚀性的铝合金钎焊片和使用该钎焊片的热交换器

    公开(公告)号：US06627330B1

    公开(公告)日：2003-09-30

    申请号：US09596934

    申请日：2000-06-19

    申请人： Masaki Shimizu ,  Haruhiko Miyachi ,  Toshihiko Fukuda ,  Hiroshi Ikeda ,  Yoshifusa Shoji

    发明人： Masaki Shimizu ,  Haruhiko Miyachi ,  Toshihiko Fukuda ,  Hiroshi Ikeda ,  Yoshifusa Shoji

    IPC分类号： B32B1501

    CPC分类号： F28F21/089 ,  B23K35/0238 ,  B23K35/286 ,  B23K2101/14 ,  B23K2103/10 ,  B32B15/016 ,  F28D1/0333 ,  F28D9/0043 ,  F28F21/084 ,  Y10S428/933 ,  Y10T428/12764

    摘要： An aluminum alloy brazing sheet has a quad-layer structure made of an outer filler material, intermediate layer material, core material, and inner filler material. The core material contains 0.5-1.6% of Mn, 0.10-0.50% of Cu, 0.05-0.50% of Mg, and 0.06-0.30% of Ti, and, as impurities, 0.5% or less of Fe, 0.5% or less of Si, and 0.1% or less of Zn, with the remainder being Al and unavoidable impurities; the intermediate layer material contains 0.2-1.5% of Mg and at least one of 0.5-4% of Zn, 0.005-0.2% of In, and 0.01-0.2% of Sn, and, as impurities, 0.3% or less of Si, 0.3% or less of Fe, 0.05% or less of Cu, 0.05% or less of Mn, and 0.3% or less of Ti, with the remainder being Al and unavoidable impurities. The thickness of the intermediate layer material is 50 &mgr;m or more and no more than the thickness of the core material. The outer filler material and the inner filler material are Al—Si—Mg alloys, the outer filler material, preferably including at least one of 0.005-0.2% of In and 0.01-0.2% of Sn.

    摘要翻译： 铝合金钎焊板具有由外部填充材料，中间层材料，芯材料和内部填充材料制成的四层结构。 芯材含有0.5-1.6％的Mn，0.10-0.50％的Cu，0.05-0.50％的Mg和0.06-0.30％的Ti，作为杂质，含有0.5％以下的Fe，0.5％以下的Fe Si和0.1％以下的Zn，其余为Al和不可避免的杂质; 中间层材料含有0.2-1.5％的Mg和0.5-4％的Zn，0.005-0.2％的In和0.01-0.2％的Sn中的至少一种，并且作为杂质，含有0.3％或更少的Si， 0.3％以下的Fe，0.05％以下的Cu，0.05％以下的Mn和0.3％以下的Ti，余量为Al和不可避免的杂质。 中间层材料的厚度为50μm以上且不大于芯材的厚度。 外部填充材料和内部填充材料是Al-Si-Mg合金，外部填充材料优选包括0.005-0.2％的In和0.01-0.2％的Sn中的至少一种。