Crossover construction of thermal-head and method of manufacturing same
    1.
    发明授权
    Crossover construction of thermal-head and method of manufacturing same 失效
    交叉结构热头及其制造方法相同

    公开(公告)号:US4446355A

    公开(公告)日:1984-05-01

    申请号:US351284

    申请日:1982-02-22

    摘要: A crossover construction of a thermal-head is which the thermal-head comprises: a substrate of insulating material; a plurality of heat elements disposed side by side in one row on said substrate; a plurality of lower thin film conductor patterns each of which connects to each of said heat elements and extends in direction X; an insulating layer disposed over said lower conductors; a plurality of upper conductor patterns disposed in parallel in another direction Y on said insulating layer so as to form a crossover on said substrate, said upper and lower conductors being selectively connected together through openings of said insulating layer, wherein said insulating layer and said upper conductors comprise printed and cured paste of insulating material and conductive material, respectively, each paste being of the low temperature curing type which can be cured at a temperature low enough not to affect the resistance of said thin film lower conductors, and a metallic layer of low resistance is coated on each of said upper conductors.

    摘要翻译: 热头的交叉结构是热头包括:绝缘材料的基底; 在所述基板上一行排列并列设置的多个加热元件; 多个下部薄膜导体图案,其各自连接到每个所述加热元件并沿方向X延伸; 设置在所述下导体上的绝缘层; 在所述绝缘层上沿另一方向Y平行设置的多个上导体图形,以便在所述衬底上形成交叉,所述上导体和下导体通过所述绝缘层的开口选择性地连接在一起,其中所述绝缘层和所述上层 导体分别包括绝缘材料和导电材料的印刷和固化糊料,每种糊料是低温固化型,其可以在足够低的温度下固化,不会影响所述薄膜下导体的电阻,并且金属层 在每个所述上导体上涂覆低电阻。