公开(公告)号：US20160354895A1

公开(公告)日：2016-12-08

申请号：US15171363

申请日：2016-06-02

Applicant: KnJ Co., LTD. ,  Samsung Display Co., Ltd.

Inventor： Gi-Hwan BAE ,  Jun-Woo HONG

IPC: B24B37/20

CPC classification number: B24B37/20

Abstract: Provided are a device and method for polishing a substrate, in which an upper ground surface, a side surface and a lower ground surface of a substrate can be simultaneously polished, and a polishing wheel can be evenly used on the whole so as to be uniformly abraded. A substrate polishing system is to polish a substrate, of which upper edge and a lower edge are polished, and includes: a table, on which the substrate is secured; a spindle provided at the upper portion of a side surface of the table; a polishing wheel formed in the shape of a cylinder and having a rotating shaft mounted perpendicularly to the substrate, so as to polish the substrate with a side surface thereof while rotating by the spindle; and a Z axis movement means for moving the polishing wheel in the vertical direction during the polishing of the substrate.

Abstract translation: 提供一种用于抛光衬底的装置和方法，其中可以同时抛光衬底的上表面，侧表面和下表面，并且可以将抛光轮整体上均匀地使用以均匀地 磨损 基板抛光系统是对抛光上边缘和下边缘的基板进行抛光，并且包括：在其上固定基板的工作台; 设置在所述工作台的侧面的上部的主轴; 抛光轮，其形成为圆柱形，并且具有垂直于基板安装的旋转轴，以便在通过所述心轴旋转的同时抛光所述基板的侧面; 以及Z轴移动装置，用于在抛光基板期间沿垂直方向移动抛光轮。