公开(公告)号：US08698190B2

公开(公告)日：2014-04-15

申请号：US13490723

申请日：2012-06-07

申请人： Kohei Yokoyama ,  Hisao Ikeda ,  Shinichi Hirasa

发明人： Kohei Yokoyama ,  Hisao Ikeda ,  Shinichi Hirasa

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L51/5203 ,  H01L51/5212 ,  H01L51/5246 ,  H01L51/5275 ,  H01L2251/5369

摘要： A lighting device is formed using a light-emitting element by a more simplified method. The lighting device includes a light-emitting element including a light-emitting layer between a first electrode and a second electrode, a substrate provided with the light-emitting element and an uneven region around the periphery of the light-emitting element, a sealing substrate facing the substrate, connection electrodes connected to the first electrode and the second electrode and formed over the uneven region, and a sealant for bonding the substrate and the sealing substrate. The connection electrodes are each formed using a conductive paste, and the sealant is in contact with the connection electrodes and the uneven region provided around the periphery of the light-emitting element.

摘要翻译： 使用更简化的方法使用发光元件形成照明装置。 照明装置包括：发光元件，其包括在第一电极和第二电极之间的发光层，设置有发光元件的基板和围绕发光元件周围的不平坦区域;密封基板 面对基板，连接到第一电极和第二电极并形成在不平坦区域上的连接电极，以及用于粘合基板和密封基板的密封剂。 连接电极各自使用导电膏形成，并且密封剂与连接电极和设置在发光元件周围的不平坦区域接触。