公开(公告)号：US08578601B2

公开(公告)日：2013-11-12

申请号：US13400809

申请日：2012-02-21

申请人： Kohichi Ohsumi ,  Kazunori Hayashi ,  Tomoharu Tsuchida

发明人： Kohichi Ohsumi ,  Kazunori Hayashi ,  Tomoharu Tsuchida

IPC分类号： H01K3/10

CPC分类号： H05K3/426 ,  H05K3/427 ,  H05K2201/0347 ,  H05K2201/09563

摘要： A method of manufacturing a printed circuit board includes forming a through hole 2 in an insulating layer 1 having upper and lower faces so as to penetrate between the upper and lower surfaces; allowing a first plated conductor 4 to be deposited at least in the through hole 2 and on the upper and lower surfaces around the through hole; removing the first plated conductor overlying and underlying a periphery of the through hole by etching the first plated conductor 4, while leaving at least the first plated conductor 4 in a mid-portion in a vertical direction within the through hole 2; and forming by semi-additive method a second plated conductor 6 that fills an outer portion than the first plated conductor 4 in the through hole 2, and forms a wiring conductor on the upper and lower surfaces.

摘要翻译： 一种制造印刷电路板的方法包括在具有上表面和下表面的绝缘层1中形成通孔2，以穿透上下表面; 允许第一镀覆导体4至少沉积在通孔2中以及围绕通孔的上表面和下表面上; 通过蚀刻第一镀覆导体4，使至少第一镀覆导体4至少在通孔2中的垂直方向的中间部分中去除覆盖在通孔周围的第一镀覆导体; 并且通过半添加法形成在通孔2中填充比第一镀覆导体4的外部的第二镀覆导体6，并且在上表面和下表面上形成布线导体。