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公开(公告)号：US20180206346A1
公开(公告)日：2018-07-19
申请号：US15786658
申请日：2017-10-18
CPC分类号： H05K3/426 , H05K1/115 , H05K3/0047 , H05K3/12 , H05K3/1216 , H05K3/3447 , H05K3/3452 , H05K3/3484 , H05K3/3494 , H05K2201/099 , H05K2203/045 , H05K2203/046 , H05K2203/0557 , H05K2203/1344
摘要： A printed circuit board manufacturing method and a printed circuit board thereof are disclosed. The printed circuit board manufacturing method includes the steps of: providing a dielectric; performing a layout process on a surface of the dielectric; drilling the dielectric to form at least one plated through hole, wherein the at least one plated through hole has an annular ring disposed on the surface of the dielectric; and coating a solder resist on the surface of the dielectric to cover at least one part of the annular ring.
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公开(公告)号：US09744624B2
公开(公告)日：2017-08-29
申请号：US14742070
申请日：2015-06-17
发明人： Jaen-Don Lan , Pin-Chung Lin , Chen-Rui Tseng , Cheng-En Ho , Yu-An Chen
IPC分类号： H05K3/46 , B23K26/402 , H05K3/42 , B23K26/382 , B23K103/00
CPC分类号： B23K26/402 , B23K26/382 , B23K26/389 , B23K2101/40 , B23K2103/172 , B23K2103/30 , B23K2103/42 , B23K2103/50 , H05K3/426 , H05K3/4644 , H05K2201/0341
摘要： Disclosed is a method for manufacturing a circuit board, including preparing a substrate having a resin layer and a stop layer, forming at least one conduction hole penetrating the resin layer and stopping at the stop layer, forming a first metal layer through a sputtering process, forming a second metal layer on the first metal layer through a chemical plating process, forming a third metal layer having a circuit pattern, exposing part of the second metal layer and filling up the conduction hole through an electroplating process, and etching the second metal layer and the first metal layer under the second metal layer to expose the resin layer under the first metal layer. Since the first metal layer provides excellent surface properties, the second and third metal layers are well fixed and stable. The etched circuit pattern has a line width/pitch less than 10 μm for fine line width/pitch.
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公开(公告)号：US09674967B2
公开(公告)日：2017-06-06
申请号：US15184426
申请日：2016-06-16
CPC分类号： H05K3/426 , H05K1/09 , H05K1/115 , H05K3/0047 , H05K3/387 , H05K2201/0221 , H05K2201/0236 , H05K2203/0709 , Y10T29/49167
摘要： A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material that has been covered with catalytic adhesive material on both faces of the dielectric laminate material. The layer of catalytic adhesive coats a portion of the dielectric laminate material around the hole. The patterned metal layer is placed over the catalytic adhesive material on both faces of the dielectric laminate material and within the hole.
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公开(公告)号：US09629260B2
公开(公告)日：2017-04-18
申请号：US14169097
申请日：2014-01-30
发明人： Seung Wook Park , Young Do Kweon , Jin Gu Kim
CPC分类号： H05K3/426 , H05K1/036 , H05K3/108 , H05K3/285 , H05K2201/0959 , H05K2203/1476
摘要： Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board according to a preferred embodiment of the present invention includes a base substrate; a through via formed to penetrate through the base substrate; and circuit patterns formed on one side and the other side of the base substrate and formed to be thinner than an inner wall of the through via.
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公开(公告)号：US09578747B2
公开(公告)日：2017-02-21
申请号：US14827668
申请日：2015-08-17
发明人： Kuo-Fu Su , Gwun-Jin Lin
CPC分类号： H05K1/115 , H05K1/028 , H05K1/0298 , H05K3/002 , H05K3/426 , Y10T29/49165
摘要： A structure of via hole of electrical circuit board includes an adhesive layer and a conductor layer that are formed after wiring is formed on a carrier board. At least one through hole extends in a vertical direction through the carrier board, the wiring, the adhesive layer, and the conductor layer and forms a hole wall surface. The conductor layer shows a height difference with respect to an exposed zone of the circuit trace in the vertical direction. A conductive cover section covers the conductor layer and the hole wall surface of the through hole. The carrier board is a single-sided board, a double-sided board, a multi-layered board, or a combination thereof, and the single-sided board, the double-sided board, and multi-layered board can be flexible boards, rigid boards, or composite boards combining flexible and rigid boards.
摘要翻译： 电路板的通孔的结构包括在载体板上形成布线之后形成的粘合剂层和导体层。 至少一个通孔在垂直方向上穿过载板，布线，粘合剂层和导体层延伸并形成孔壁表面。 导体层相对于垂直方向上的电路迹线的暴露区域显示高度差。 导电覆盖部分覆盖导体层和通孔的孔壁表面。 载板是单面板，双面板，多层板或其组合，单面板，双面板和多层板可以是柔性板， 刚性板，或组合柔性和刚性板的复合板。
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公开(公告)号：US20160353584A1
公开(公告)日：2016-12-01
申请号：US14957861
申请日：2015-12-03
发明人： Shojiro Honda , Yosuke Haruki , Hajime Kiyokawa
CPC分类号： H05K3/423 , C25D3/38 , C25D5/022 , C25D5/48 , C25D5/54 , C25D7/123 , H05K3/426 , H05K2201/09563 , H05K2203/1383
摘要： A process for efficiently producing a wiring board in which an insulating substrate 1 having a through hole 2 is used, which includes forming a seed layer 3 on one surface of the insulating substrate 1, covering the surface of the insulating substrate 1 on which the seed layer 3 is formed with a masking film 4, arranging the insulating substrate 1 and a positive electrode 5 so that the surface of the insulating substrate 1 opposite to the surface of the insulating substrate 1 on which the seed layer 3 of the insulating substrate 1 is formed is faced to the positive electrode 5, carrying out electroplating to form a metal layer 8 in the through hole 2, and then removing the masking film 4.
摘要翻译： 一种用于有效地制造其中使用具有通孔2的绝缘基板1的布线板的方法，其包括在绝缘基板1的一个表面上形成种子层3，覆盖绝缘基板1的表面，其上种子 层3形成有掩模膜4，布置绝缘基板1和正极5，使得绝缘基板1的与绝缘基板1的种子层3的绝缘基板1的表面相反的表面是绝缘基板1的表面， 形成在正电极5上，进行电镀以在通孔2中形成金属层8，然后除去掩模膜4。
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公开(公告)号：US20160353569A1
公开(公告)日：2016-12-01
申请号：US15158777
申请日：2016-05-19
发明人： Jun FURUICHI , Noriyoshi SHIMIZU
CPC分类号： H05K1/0298 , H01L21/4857 , H01L23/49822 , H01L23/49827 , H05K1/036 , H05K1/0366 , H05K1/115 , H05K3/0044 , H05K3/108 , H05K3/426 , H05K3/4602 , H05K3/4623 , H05K3/4644 , H05K2201/0183 , H05K2201/0191 , H05K2201/0376 , H05K2201/09536 , H05K2201/09563 , H05K2201/0979 , H05K2203/025
摘要： A wiring substrate includes a core layer having a penetrating hole, a first insulating layer disposed on a first surface of the core layer and having a first opening at a position of the penetrating hole, the first insulating layer containing no filler, a penetrating electrode disposed in the penetrating hole and in the first opening, and a first wiring layer laminated both on the first insulating layer at a first surface thereof facing away from the core layer and on an end face of the penetrating electrode, wherein the first surface of the first insulating layer and the end face of the penetrating electrode are planarized.
摘要翻译： 布线基板包括具有穿透孔的芯层，设置在芯层的第一表面上的第一绝缘层，并且在穿透孔的位置处具有第一开口，第一绝缘层不包含填料，设置穿透电极 在所述贯通孔和所述第一开口中的第一表面以及在所述第一绝缘层上层叠的第一布线层，所述第一布线层在其背离所述芯层的第一表面和所述穿透电极的端面上， 绝缘层和穿透电极的端面被平坦化。
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公开(公告)号：US09443788B2
公开(公告)日：2016-09-13
申请号：US13966633
申请日：2013-08-14
发明人： Takamasa Takano
IPC分类号： H05K1/11 , H01L23/48 , H01L21/48 , H01L21/768 , H01L23/14 , H01L23/498 , H05K3/42 , H05K3/44
CPC分类号： H01L23/49827 , H01L21/486 , H01L21/76898 , H01L23/147 , H01L23/481 , H01L23/49833 , H01L23/49838 , H01L23/49866 , H01L23/49894 , H01L24/17 , H01L2224/16225 , H01L2224/16235 , H01L2924/014 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/15747 , H01L2924/15786 , H01L2924/1579 , H05K1/113 , H05K3/426 , H05K3/445 , H05K2201/09436 , H05K2201/09581 , H05K2201/09609 , H05K2201/09836 , H05K2201/09854 , H05K2201/10378 , H05K2203/0733 , H05K2203/1178 , Y10T29/49117 , Y10T29/49124 , Y10T29/49165 , H01L2224/05647 , H01L2924/01024 , H01L2924/01079
摘要： A method of manufacturing a through-hole electrode substrate includes forming a plurality of through-holes in a substrate, forming a plurality of through-hole electrodes by filling a conductive material into the plurality of through-holes, forming a first insulation layer on one surface of the substrate, forming a plurality of first openings which expose the plurality of through-hole electrodes corresponding to each of the plurality of through-hole electrodes, on the first insulation layer and correcting a position of the plurality of first openings using the relationship between a misalignment amount of a measured distance value of an open position of a leaning through-hole among the plurality of through-holes and of a design distance value of the open position of the leaning through-hole among the plurality of through-holes with respect to a center position of the substrate.
摘要翻译： 一种制造通孔电极基板的方法包括在基板上形成多个通孔，通过在多个通孔中填充导电材料形成多个通孔电极，在一个通孔上形成第一绝缘层 在所述第一绝缘层上形成多个第一开口，所述多个第一开口将与所述多个通孔电极中的每一个相对应的多个通孔电极暴露在所述第一绝缘层上，并且使用所述关系来校正所述多个第一开口的位置 在多个通孔中的倾斜通孔的打开位置的测量距离值的偏移量与多个通孔中的倾斜通孔的打开位置的设计距离值之间， 相对于基板的中心位置。
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公开(公告)号：US09398703B2
公开(公告)日：2016-07-19
申请号：US14281802
申请日：2014-05-19
CPC分类号： H05K3/426 , H05K1/09 , H05K1/115 , H05K3/0047 , H05K3/387 , H05K2201/0221 , H05K2201/0236 , H05K2203/0709 , Y10T29/49167
摘要： A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material that has been covered with catalytic adhesive material on both faces of the dielectric laminate material. The layer of catalytic adhesive coats a portion of the dielectric laminate material around the hole. The patterned metal layer is placed over the catalytic adhesive material on both faces of the dielectric laminate material and within the hole.
摘要翻译： 印刷电路板中的通孔由延伸穿过电介质层压材料中的孔的图案化金属层组成，该电介质层压材料已经在介电层压材料的两个表面上被催化粘合剂材料覆盖。 催化粘合剂层将电介质层叠材料的一部分涂覆在孔周围。 图案化的金属层放置在介电层压材料的两个表面上和孔内的催化粘合剂材料上。
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公开(公告)号：US20160192490A1
公开(公告)日：2016-06-30
申请号：US14966518
申请日：2015-12-11
发明人： Myung-Sam KANG , Young-Gwan KO , Sang-Hoon KIM , Kang-Wook BONG , Hye-Won JUNG , Yong-Wan JI
CPC分类号： H05K1/115 , H05K1/0326 , H05K1/0346 , H05K3/0023 , H05K3/426 , H05K3/428 , H05K2201/0129 , H05K2201/0154 , H05K2201/09827 , H05K2201/09854 , H05K2203/1476
摘要： A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an insulating layer including a first resin layer and a second resin layer, circuit layers disposed on upper and lower surfaces of the insulating layer, and a via configured to connect the circuit layer formed on the upper surface to the circuit layer formed on the lower surface, and the second resin layer extends from an upper surface of the first resin layer to a lower surface of the first resin layer by passing through the first resin layer as to contact a side surface of the via.
摘要翻译： 提供一种印刷电路板及其制造方法。 印刷电路板包括绝缘层，其包括第一树脂层和第二树脂层，设置在绝缘层的上表面和下表面上的电路层，以及通孔，被配置为将形成在上表面上的电路层连接到电路层 形成在下表面上，第二树脂层通过第一树脂层从第一树脂层的上表面延伸到第一树脂层的下表面，以接触通孔的侧表面。
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