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1.发明申请公开(公告)号：US20180269372A1
公开(公告)日：2018-09-20
申请号：US15974980
申请日：2018-05-09
发明人： Hyun Jung LEE , Soo Hyun Kim , Yong Myeong Kim , Hyun Woo Bark
CPC分类号： H01L35/34 , C08J5/18 , C08L23/0846 , C08L25/08 , C08L27/06 , C08L79/08 , H01L35/14 , H01L35/24
摘要： A method of preparing the thermoelectric materials includes coating a thin film of a material having a Seebeck coefficient of ±μV/K or greater on one surface of a substrate, coating a polymer precursor solution for forming a polymer having a glass transition temperature (Tg) of about 50° C. or greater on a top surface of the material thin film, forming a polymer layer on the top surface of the material thin film by curing the polymer precursor solution, and preparing the self-standing flexible thermoelectric composite structure by separating the polymer layer formed on the top surface of the material thin film from the substrate.
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2.发明授权公开(公告)号：US10651360B2
公开(公告)日：2020-05-12
申请号：US15974980
申请日：2018-05-09
发明人： Hyun Jung Lee , Soo Hyun Kim , Yong Myeong Kim , Hyun Woo Bark
IPC分类号： H01L35/34 , H01L35/24 , H01L35/14 , C08L79/08 , C08J5/18 , C08L23/08 , C08L25/08 , C08L27/06
摘要： A method of preparing the thermoelectric materials includes coating a thin film of a material having a Seebeck coefficient of ±μV/K or greater on one surface of a substrate, coating a polymer precursor solution for forming a polymer having a glass transition temperature (Tg) of about 50° C. or greater on a top surface of the material thin film, forming a polymer layer on the top surface of the material thin film by curing the polymer precursor solution, and preparing the self-standing flexible thermoelectric composite structure by separating the polymer layer formed on the top surface of the material thin film from the substrate.
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