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公开(公告)号:US20130141156A1
公开(公告)日:2013-06-06
申请号:US13567749
申请日:2012-08-06
申请人: Koon Hoo Teo , Peijie Feng , Chunjie Duan , Toshiyuki Oishi , Nakayama Masatoshi
发明人: Koon Hoo Teo , Peijie Feng , Chunjie Duan , Toshiyuki Oishi , Nakayama Masatoshi
IPC分类号: H01L29/778 , G05F1/00
CPC分类号: H01L29/7783 , H01L29/2003 , H01L2924/0002 , H01L2924/00
摘要: A device includes a source for transmitting an electronic charge through a conduction path; a drain for receiving the electronic charge; a stack for providing at least part of the conduction path; and a gate operatively connected to the stack for controlling a conduction of the electronic charge. The stack includes an insulator layer, an N-polar layer and a barrier layer selected such that, during an operation of the device, the conduction path formed in the N-polar layer includes a two-dimensional electron gas (2DEG) channel and an inversion carrier channel.
摘要翻译: 一种装置包括用于通过导电路径发送电荷的源; 用于接收电子费用的排水口; 用于提供所述传导路径的至少一部分的堆叠; 以及可操作地连接到所述堆叠的门,用于控制所述电子电荷的导通。 该堆叠包括绝缘体层,N极层和阻挡层,其被选择为使得在器件的操作期间,形成在N极层中的导电路径包括二维电子气(2DEG)通道和 反向载波信道。
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公开(公告)号:US08624667B2
公开(公告)日:2014-01-07
申请号:US13567749
申请日:2012-08-06
申请人: Koon Hoo Teo , Peijie Feng , Chunjie Duan , Toshiyuki Oishi , Nakayama Masatoshi
发明人: Koon Hoo Teo , Peijie Feng , Chunjie Duan , Toshiyuki Oishi , Nakayama Masatoshi
IPC分类号: H01L25/00
CPC分类号: H01L29/7783 , H01L29/2003 , H01L2924/0002 , H01L2924/00
摘要: A device includes a source for transmitting an electronic charge through a conduction path; a drain for receiving the electronic charge; a stack for providing at least part of the conduction path; and a gate operatively connected to the stack for controlling a conduction of the electronic charge. The stack includes an insulator layer, an N-polar layer and a barrier layer selected such that, during an operation of the device, the conduction path formed in the N-polar layer includes a two-dimensional electron gas (2DEG) channel and an inversion carrier channel.
摘要翻译: 一种装置包括用于通过导电路径发送电荷的源; 用于接收电子费用的排水口; 用于提供所述传导路径的至少一部分的堆叠; 以及可操作地连接到所述堆叠的门,用于控制所述电子电荷的导通。 该堆叠包括绝缘体层,N极层和阻挡层,其被选择为使得在器件的操作期间,形成在N极层中的导电路径包括二维电子气(2DEG)通道和 反向载波信道。
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