公开(公告)号：US20210203069A1

公开(公告)日：2021-07-01

申请号：US16786034

申请日：2020-02-10

Applicant: Korea Advanced Institute of Science and Technology

Inventor： Chulsoon PARK ,  Honghyun BAE

IPC: H01Q1/52 ,  H01Q9/04 ,  H01Q9/06

Abstract: A dual-polarized antenna with high isolation is disclosed. A first differential signal feeding unit extends from a first input port toward one side of a patch radiator through a dielectric substrate, and is branched into a balun structure to provide first and second feeding probes for differentially feeding vertically polarized signals to opposite first and second portions of the patch radiator. A second differential signal feeding unit extends from a second input port toward another side of the patch radiator through the dielectric substrate, and is branched into the balun structure to provide third and fourth feeding probes for differentially feeding horizontally polarized signals to opposite third and fourth portions of the patch radiator. When feeding the vertically polarized signals through the first and second feeding probes, a virtual ground region in which there is little electric field is formed in the center portion of the patch radiator. The cross-sectional polarization components of the third and fourth probes are also greatly reduced, so that they hardly exist. A soft surface structure surrounding the patch radiator and the first to fourth probes can improve the radiation pattern deterioration caused by diffraction of surface waves.

公开(公告)号：US20160118721A1

公开(公告)日：2016-04-28

申请号：US14830335

申请日：2015-08-19

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Chulsoon PARK ,  Hojung KIM ,  Hongyi KIM ,  Innyeal OH ,  Joongho LEE ,  Taehwan JANG

IPC: H01Q9/28

CPC classification number: H01Q9/28 ,  H01Q1/2283

Abstract: Provided are chip antennas for near field communication and methods of manufacturing the chip antennas. A chip antenna for near field communication includes a substrate; a first antenna element on the substrate; and a second antenna element on the first antenna element. The substrate, the first antenna element, and the second antenna element are included in a single chip. The first and second antenna elements are formed outside the chip. The substrate is a lower layer including a plurality of devices. The first antenna element is a metal structure having a fish bone shape. The second antenna element is a dipole antenna.

Abstract translation: 提供了用于近场通信的芯片天线和制造芯片天线的方法。 用于近场通信的芯片天线包括基板; 基板上的第一天线元件; 以及第一天线元件上的第二天线元件。 衬底，第一天线元件和第二天线元件包括在单个芯片中。 第一和第二天线元件形成在芯片外部。 衬底是包括多个器件的下层。 第一天线元件是具有鱼骨形状的金属结构。 第二天线元件是偶极天线。