公开(公告)号：US10128557B2

公开(公告)日：2018-11-13

申请号：US15342551

申请日：2016-11-03

Applicant: Korea Advanced Institute of Science and Technology

Inventor： Hyeon Min Bae ,  Ha II Song ,  HuXian Jin ,  Joon Yeong Lee ,  Hyo Sup Won ,  Tae Hoon Yoon

IPC: H01P5/107 ,  H01P5/08 ,  H01P3/08 ,  H01P3/16 ,  H01P3/12

Abstract: The present invention relates to a microstrip circuit and a chip-to-chip interface apparatus comprising the same. According to one aspect of the invention, there is provided a microstrip circuit. The microstrip circuit includes a feeding line providing a signal, a probe being connected to one end of the feeding line, and a patch emitting the signal to a waveguide. The patch is disposed in a layer opposite to a layer in which the feeding line and the probe are disposed, with a core substrate being positioned therebetween. At least one of length of the probe, thickness of the core substrate, and permittivity of the core substrate is determined based on bandwidth of a transition between the microstrip circuit and the waveguide.