公开(公告)号：US09853386B1

公开(公告)日：2017-12-26

申请号：US15474672

申请日：2017-03-30

Applicant: Korea Institute of Science and Technology

Inventor： Woosub Lee ,  Seonghun Hong ,  Sung Chul Kang ,  Kang Gyun Kim

IPC: H01R13/28 ,  H01R13/24 ,  H01R13/622

CPC classification number: H01R13/2421 ,  H01R13/24 ,  H01R13/622 ,  H01R24/84

Abstract: A module connection mechanism for coupling adjacent modules, has a connector for connecting the modules. The connector has a substrate having a plurality of terminals for transmitting power and signals, installed between the modules, a fixing body disposed to surround the substrate and having a fixing wing with a wing thread formed at an outer surface thereof, and a fixing ring disposed to surround the fixing body and having a ring thread formed at an inner surface thereof, so that the ring thread moves to cover an outer surface of the fixing body.