公开(公告)号：US06682872B2

公开(公告)日：2004-01-27

申请号：US10056245

申请日：2002-01-22

申请人： Krishna G. Sachdev ,  Michael Berger ,  Rebecca Y. Gorrell ,  Gregg B. Monjeau ,  Bernadette H. Perry ,  Thomas A. Wassick

发明人： Krishna G. Sachdev ,  Michael Berger ,  Rebecca Y. Gorrell ,  Gregg B. Monjeau ,  Bernadette H. Perry ,  Thomas A. Wassick

IPC分类号： G03C500

CPC分类号： C08F290/048 ,  C08L13/00 ,  G03F7/033 ,  G03F7/038 ,  H05K3/287 ,  Y10S430/106 ,  Y10S430/114 ,  Y10T428/31583 ,  Y10T428/31587 ,  Y10T428/31935

摘要： Radiation-curable compositions are provided for use in the fabrication of electronic components as passivation coatings; for defect repair in ceramic and thin film products by micropassivation in high circuit density electronic modules to allow product recovery; as a solder mask in electronic assembly processes; for use as protective coatings on printed circuit board (PCB) circuitry and electronic devices against mechanical damage and corrosion from exposure to the environment. The compositions are solvent-free, radiation-curable, preferably uv-curable, containing a polymer binder, which is a pre-formed thermoplastic or elastomeric polymer/oligomer, a monofunctional and/or bifunctional acrylic monomer, a multifunctional (more than 2 reactive groups) acrylated/methacrylated monomer, and a photoinitiator, where all the constituents are mutually miscible forming a homogeneous viscous blend without the addition of an organic solvent. The compositions may also contain inorganic fillers and/or nanoparticle fillers.

摘要翻译： 提供可辐射固化的组合物用于制造电子部件作为钝化涂层; 通过在高电路密度电子模块中的微激活来对陶瓷和薄膜产品进行缺陷修复，以允许产品回收; 作为电子组装工艺中的焊接掩模; 用作印刷电路板（PCB）电路和电子设备上的保护涂层，防止暴露于环境中的机械损伤和腐蚀。 该组合物是无溶剂的，可辐射固化的，优选可紫外固化的，其包含聚合物粘合剂，其为预成型的热塑性或弹性体聚合物/低聚物，单官能和/或双官能丙烯酸单体，多官能（多于2个反应性 基团）丙烯酸酯化/甲基丙烯酸酯化的单体和光引发剂，其中所有组分是相互混溶的，而不加入有机溶剂形成均匀的粘稠共混物。 组合物还可以含有无机填料和/或纳米颗粒填料。