公开(公告)号：US5808853A

公开(公告)日：1998-09-15

申请号：US846930

申请日：1997-04-30

申请人： Hormazdyar M. Dalal ,  Gene Joseph Gaudenzi ,  Rebecca Y. Gorrell ,  Mark A. Takacs ,  Kenneth J. Travis, Jr.

发明人： Hormazdyar M. Dalal ,  Gene Joseph Gaudenzi ,  Rebecca Y. Gorrell ,  Mark A. Takacs ,  Kenneth J. Travis, Jr.

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/498 ,  H01L23/538 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H01G4/228

CPC分类号： H01L21/563 ,  H01L23/49816 ,  H01L23/5387 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H05K3/341 ,  H05K3/3436 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/136 ,  H01L2224/13609 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K1/189 ,  H05K2201/035 ,  H05K2201/10015 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0165 ,  H05K3/0061 ,  H05K3/3484 ,  Y02P70/613

摘要： This invention is directed to a capacitor having a multilevel interconnection technology. At least one solder ball is reflowed and secured onto the capacitor. The solder ball is in electrical communication with the capacitor through a contact. On this reflowed solder ball a cap of low melting point metal is secured. This can be done in a number of ways. The preferred way is to positioning a mask over the solder ball such that a portion of the solder ball is exposed through openings in the mask. At least one layer of a low melting point metal is deposited on the exposed surface of the solder ball through the mask, and thereby forming a capacitor with a multilevel interconnect cap. The low melting point metal can interact with the surface of the solder ball to form a cap of an eutectic or a liquefied portion. The cap portion can then be joined to the object.

摘要翻译： 本发明涉及具有多层互连技术的电容器。 至少一个焊球被回流并固定在电容器上。 焊球通过触点与电容器电连通。 在这个回流的焊球上，确保了低熔点金属的盖子。 这可以通过多种方式完成。 优选的方式是将掩模定位在焊球上，使得焊球的一部分通过掩模中的开口露出。 通过掩模将至少一层低熔点金属沉积在焊球的暴露表面上，从而形成具有多层互连盖的电容器。 低熔点金属可以与焊球的表面相互作用以形成共晶或液化部分的盖。 盖部分然后可以连接到物体。

公开(公告)号：US06336262B1

公开(公告)日：2002-01-08

申请号：US08846931

申请日：1997-04-30

申请人： Hormazdyar M. Dalal ,  Gene Joseph Gaudenzi ,  Rebecca Y. Gorrell ,  Mark A. Takacs ,  Kenneth J. Travis, Jr.

发明人： Hormazdyar M. Dalal ,  Gene Joseph Gaudenzi ,  Rebecca Y. Gorrell ,  Mark A. Takacs ,  Kenneth J. Travis, Jr.

IPC分类号： H01G700

CPC分类号： H01L21/563 ,  H01L23/49816 ,  H01L23/5387 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05568 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/341 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/035 ,  H05K2201/10015 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0165 ,  Y02P70/613 ,  Y10T29/435 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49213 ,  H01L2224/05599 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2924/013 ,  H01L2924/01074

摘要： A capacitor having a multilevel interconnection technology and process thereof. Also disclosed is a process of electrically connecting a capacitor to an object, comprising the steps of first obtaining a capacitor. At least one solder ball is reflowed and secured onto the capacitor. The solder ball is in electrical communication with the capacitor through a contacting means. On this reflowed solder ball a cap of low melting point metal is secured. This can be done in a number of ways. The preferred way is to positioning a mask over the solder ball such that a portion of the solder ball is exposed through openings in the mask. At least one layer of a low melting point metal is deposited on the exposed surface of the solder ball through the mask, and thereby forming a capacitor with a multilevel interconnect cap. The low melting point metal can interact with the surface of the solder ball to form a cap of an eutectic or a liquefied portion. The cap portion can then be joined to the object.

摘要翻译： 一种具有多层互连技术的电容器及其工艺。 还公开了将电容器电连接到物体的处理，包括以下步骤：首先获得电容器。 至少一个焊球被回流并固定在电容器上。 焊球通过接触装置与电容器电连通。 在这个回流的焊球上，确保了低熔点金属的盖子。 这可以通过多种方式完成。 优选的方式是将掩模定位在焊球上，使得焊球的一部分通过掩模中的开口露出。 通过掩模将至少一层低熔点金属沉积在焊球的暴露表面上，从而形成具有多层互连盖的电容器。 低熔点金属可以与焊球的表面相互作用以形成共晶或液化部分的盖。 盖部分然后可以连接到物体。

公开(公告)号：US06682872B2

公开(公告)日：2004-01-27

申请号：US10056245

申请日：2002-01-22

申请人： Krishna G. Sachdev ,  Michael Berger ,  Rebecca Y. Gorrell ,  Gregg B. Monjeau ,  Bernadette H. Perry ,  Thomas A. Wassick

发明人： Krishna G. Sachdev ,  Michael Berger ,  Rebecca Y. Gorrell ,  Gregg B. Monjeau ,  Bernadette H. Perry ,  Thomas A. Wassick

IPC分类号： G03C500

CPC分类号： C08F290/048 ,  C08L13/00 ,  G03F7/033 ,  G03F7/038 ,  H05K3/287 ,  Y10S430/106 ,  Y10S430/114 ,  Y10T428/31583 ,  Y10T428/31587 ,  Y10T428/31935

摘要： Radiation-curable compositions are provided for use in the fabrication of electronic components as passivation coatings; for defect repair in ceramic and thin film products by micropassivation in high circuit density electronic modules to allow product recovery; as a solder mask in electronic assembly processes; for use as protective coatings on printed circuit board (PCB) circuitry and electronic devices against mechanical damage and corrosion from exposure to the environment. The compositions are solvent-free, radiation-curable, preferably uv-curable, containing a polymer binder, which is a pre-formed thermoplastic or elastomeric polymer/oligomer, a monofunctional and/or bifunctional acrylic monomer, a multifunctional (more than 2 reactive groups) acrylated/methacrylated monomer, and a photoinitiator, where all the constituents are mutually miscible forming a homogeneous viscous blend without the addition of an organic solvent. The compositions may also contain inorganic fillers and/or nanoparticle fillers.

摘要翻译： 提供可辐射固化的组合物用于制造电子部件作为钝化涂层; 通过在高电路密度电子模块中的微激活来对陶瓷和薄膜产品进行缺陷修复，以允许产品回收; 作为电子组装工艺中的焊接掩模; 用作印刷电路板（PCB）电路和电子设备上的保护涂层，防止暴露于环境中的机械损伤和腐蚀。 该组合物是无溶剂的，可辐射固化的，优选可紫外固化的，其包含聚合物粘合剂，其为预成型的热塑性或弹性体聚合物/低聚物，单官能和/或双官能丙烯酸单体，多官能（多于2个反应性 基团）丙烯酸酯化/甲基丙烯酸酯化的单体和光引发剂，其中所有组分是相互混溶的，而不加入有机溶剂形成均匀的粘稠共混物。 组合物还可以含有无机填料和/或纳米颗粒填料。