Apparatus and method for thermal processing of semiconductor substrates
    1.
    发明授权
    Apparatus and method for thermal processing of semiconductor substrates 失效
    半导体衬底的热处理装置和方法

    公开(公告)号:US06342691B1

    公开(公告)日:2002-01-29

    申请号:US09439833

    申请日:1999-11-12

    IPC分类号: F27B514

    CPC分类号: H01L21/67115 C30B31/12

    摘要: A semiconductor substrate processing system and method of using a stable heating source with a large thermal mass relative to conventional lamp heating systems. The system dimensions and processing parameters are selected to provide a substantial heat flux to the substrate while reducing the potential of heat loss to the surrounding environment, particularly from the edges of the heat source and substrate. Aspects of the present invention include a dual resistive heater system comprising a base or primary heater, surrounded by a peripheral or edge heater. The impedance of the edge heater may be substantially matched to that of the primary heater such that a single power supply may be used to supply power to both heaters. Both resistive heaters deliver heat to a heated block, and the heaters and heated block are substantially enclosed within an insulated cavity. The walls of the insulated cavity may include multiple layers of insulation, and these layers may be substantially concentrically arranged. The innermost layers may comprise silicon carbide coated graphite; the outer layers may comprise opaque quartz. An embodiment of the invention includes a vacuum spool having a large conduction pathway for exhausting gases from the region of the chamber containing the resistive heaters, and a small conduction pathway for removing gases from other regions of the chamber. Temperature measurement sensors include thermocouples and optical pyrometers, with the advantage that a thermocouple may be used to calibrate an optical pyrometer in situ. An insulating shutter may be used to insulate the port through which substrates are inserted into the insulated and heated cavity. Support posts and gas injectors may include ports for optical pyrometers.

    摘要翻译: 相对于传统的灯加热系统,半导体衬底处理系统和使用具有大热质量的稳定的热源的方法。 选择系统尺寸和处理参数以向基板提供实质的热通量,同时减少对周围环境,特别是从热源和基板的边缘的热损失的潜力。 本发明的方面包括双电阻加热器系统,其包括被周边或边缘加热器包围的基座或主加热器。 边缘加热器的阻抗可以与初级加热器的阻抗基本匹配,使得单个电源可以用于向两个加热器供电。 两个电阻加热器将热量传递到加热块,并且加热器和加热块基本上封闭在绝缘腔内。 绝缘腔的壁可以包括多层绝缘体,并且这些层可以基本上同心地布置。 最内层可包括碳化硅涂覆的石墨; 外层可以包括不透明的石英。 本发明的实施例包括具有用于从包含电阻加热器的室的区域排出气体的大的传导路径的真空阀芯,以及用于从腔室的其它区域去除气体的小的传导路径。 温度测量传感器包括热电偶和光学高温计,其优点是热电偶可用于原位校准光学高温计。 可以使用绝缘快门来将通过哪个基板插入绝缘和加热腔的端口绝缘。 支撑柱和气体注入器可以包括用于光学高温计的端口。

    Thin film electrostatic shield for inductive plasma processing

    公开(公告)号:US06554953B2

    公开(公告)日:2003-04-29

    申请号:US09952640

    申请日:2001-09-13

    IPC分类号: H05H100

    CPC分类号: H01J37/321

    摘要: A plasma reactor and methods for processing semiconductor substrates are described. An induction coil inductively couples power into the reactor to produce a plasma. A thin electrostatic shield is interposed between the induction coil and plasma to reduce capacitive coupling. The shield is electromagnetically thin such that inductive power passes through the shield to sustain the plasma while capacitive coupling is substantially attenuated. Reducing capacitive coupling reduces modulation of the plasma potential relative to the substrate and allows for more controllable processing.

    Thin film electrostatic shield for inductive plasma processing
    6.
    发明授权
    Thin film electrostatic shield for inductive plasma processing 失效
    薄膜静电屏蔽用于感应等离子体处理

    公开(公告)号:US06312555B1

    公开(公告)日:2001-11-06

    申请号:US09528562

    申请日:2000-03-20

    IPC分类号: H05H100

    CPC分类号: H01J37/321

    摘要: A plasma reactor and methods for processing semiconductor substrates are described. An induction coil inductively couples power into the reactor to produce a plasma. A thin electrostatic shield is interposed between the induction coil and plasma to reduce capacitive coupling. The shield is electromagnetically thin such that inductive power passes through the shield to sustain the plasma while capacitive coupling is substantially attenuated. Reducing capacitive coupling reduces modulation of the plasma potential relative to the substrate and allows for more controllable processing.

    摘要翻译: 描述等离子体反应器和半导体衬底的处理方法。 感应线圈将电力电感耦合到反应器中以产生等离子体。 在感应线圈和等离子体之间插入薄静电屏蔽以减少电容耦合。 屏蔽电磁薄,使得感应功率通过屏蔽以维持等离子体,同时电容耦合基本衰减。 减小电容耦合减少了等离子体电位相对于衬底的调制,并允许更可控的处理。