公开(公告)号：US07977231B1

公开(公告)日：2011-07-12

申请号：US12941174

申请日：2010-11-08

申请人： Kui Kam Lam ,  Yen Hsi Tang ,  Yiu Yan Wong ,  Hok Man Wan

发明人： Kui Kam Lam ,  Yen Hsi Tang ,  Yiu Yan Wong ,  Hok Man Wan

IPC分类号： H01L21/44

CPC分类号： H01L21/6715 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L2224/27312 ,  H01L2224/29036 ,  H01L2224/2919 ,  H01L2224/743 ,  H01L2224/75611 ,  H01L2224/75744 ,  H01L2224/759 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0665

摘要： Adhesive is dispensed for conducting die bonding onto a substrate including rows of bond pads aligned along a first axis and columns of bond pads aligned along a second axis transverse to the first axis where target dispensing positions are located. A first dispensing head incorporating a first nozzle and a second dispensing head incorporating a second nozzle are provided and the substrate is fed along the first axis to a position where the first and second dispensing heads are located. Pattern recognition of a columnar section of the substrate comprising one or more consecutive columns of bond pads with an optical system may be conducted by moving the optical system along the second axis relative to the substrate. Thereafter, the first nozzle and the second nozzle are driven concurrently to dispense adhesive from the first and second nozzles onto the target dispensing positions in the same columnar section of the substrate.

摘要翻译： 粘合剂被分配用于导电管芯接合到基底上，该衬底包括沿着第一轴线排列的接合焊盘列，以及沿着与目标分配位置所在的第一轴线相交的第二轴线排列的接合焊盘列。 提供了包括第一喷嘴的第一分配头和结合有第二喷嘴的第二分配头，并且基板沿着第一轴线被供给到第一和第二分配头所在的位置。 可以通过沿相对于衬底的第二轴移动光学系统来进行包括具有光学系统的一个或多个连续的接合焊盘的衬底的柱状截面的图案识别。 此后，同时驱动第一喷嘴和第二喷嘴，以将粘合剂从第一和第二喷嘴分配到基板的相同柱状部分中的目标分配位置上。