公开(公告)号：US11929260B2

公开(公告)日：2024-03-12

申请号：US17410958

申请日：2021-08-24

申请人： Applied Materials, Inc.

发明人： Fang Jie Lim ,  Chin Wei Tan ,  Jun-Liang Su ,  Felix Deng ,  Sai Kumar Kodumuri ,  Ananthkrishna Jupudi ,  Nuno Yen-Chu Chen

IPC分类号： H01L21/56 ,  H01L21/67 ,  H01L21/683 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L21/56 ,  H01L21/563 ,  H01L21/67109 ,  H01L21/67115 ,  H01L24/75 ,  H01L24/83 ,  H01L21/6838 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/73204 ,  H01L2224/75272 ,  H01L2224/7555 ,  H01L2224/75744 ,  H01L2224/75985 ,  H01L2224/75986 ,  H01L2224/83047 ,  H01L2224/83048 ,  H01L2224/8322 ,  H01L2224/8385 ,  H01L2224/83908 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/3511

摘要： Embodiments of methods and apparatus for reducing warpage of a substrate are provided herein. In some embodiments, a method for reducing warpage of a substrate includes: applying an epoxy mold over a plurality of dies on the substrate in a dispenser tool; placing the substrate on a pedestal in a curing chamber, wherein the substrate has an expected post-cure deflection in a first direction; inducing a curvature on the substrate in a direction opposite the first direction; and curing the substrate by heating the substrate in the curing chamber.

公开(公告)号：US20230230954A1

公开(公告)日：2023-07-20

申请号：US18010456

申请日：2022-03-28

申请人： Board of Regents, The University of Texas System

发明人： Sidlgata V. Sreenivasan ,  Paras Ajay ,  Akhila Mallavarapu ,  Crystal Barrera

IPC分类号： H01L23/00 ,  H01L21/66 ,  H01L21/68 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687

CPC分类号： H01L24/83 ,  H01L22/14 ,  H01L21/68 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/68771 ,  H01L24/75 ,  H01L2221/68368 ,  H01L2224/80908 ,  H01L2224/80006 ,  H01L2224/83005 ,  H01L2224/83908 ,  H01L2224/75744

摘要： A system for assembling fields from a source substrate onto a second substrate. The source substrate includes fields. The system further includes a transfer chuck that is used to pick at least four of the fields from the source substrate in parallel to be transferred to the second substrate, where the relative positions of the at least four of the fields is predetermined.

公开(公告)号：US20190189586A1

公开(公告)日：2019-06-20

申请号：US16205184

申请日：2018-11-29

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： RYO FUJITA

IPC分类号： H01L23/00 ,  H01L33/62 ,  H01L33/64 ,  B23K3/03 ,  B23K35/26

CPC分类号： H01L24/75 ,  B23K3/0338 ,  B23K35/262 ,  H01L24/32 ,  H01L24/83 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/32245 ,  H01L2224/75253 ,  H01L2224/75744 ,  H01L2224/83075 ,  H01L2224/83815 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2933/0066

摘要： A component joining apparatus, which can realize positioning between a component and a substrate with high accuracy by avoiding influence of thermal expansion of the substrate at the time of joining the component to the substrate by heating at a high temperature, includes a component supply head holding a component and a heating stage heating and holding a substrate, in which a heating region where the heating stage contacts the substrate includes a joining region of the substrate in which the component is joined, and the substrate is larger than the heating stage and a peripheral part of the substrate does not contact the heating stage.

公开(公告)号：US09984943B2

公开(公告)日：2018-05-29

申请号：US15388625

申请日：2016-12-22

申请人： Massachusetts Institute of Technology

发明人： Keith Warner ,  Richard P. D'Onofrio ,  Donna-Ruth W. Yost

IPC分类号： H01L21/66 ,  H01L23/00 ,  H01L27/06

CPC分类号： H01L22/20 ,  H01L21/6835 ,  H01L21/76898 ,  H01L21/8221 ,  H01L22/12 ,  H01L23/544 ,  H01L24/75 ,  H01L24/80 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L27/0688 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/80006 ,  H01L2224/8013 ,  H01L2224/80896 ,  H01L2224/8203 ,  H01L2224/821 ,  H01L2224/8313 ,  H01L2224/9222 ,  H01L2224/80001 ,  H01L2224/82

摘要： In a system for aligning at least two semiconductor structures for coupling, an alignment device includes a mounting structure having at least first and second opposing portions. The alignment device also includes a first mounting portion movably coupled to the first portion of the mounting structure, the first mounting portion configured to couple to a first surface of a first semiconductor structure. The alignment device additionally includes a second mounting portion movably coupled to the second portion of the mounting structure, the second mounting portion configured to couple to a second surface of a second semiconductor structure. The alignment device further includes one or more imaging devices disposed above at least one of the first and second mounting portions of the alignment device, the imaging devices configured to capture and/or or detect alignment marks in at least the first semiconductor structure. A corresponding method for aligning two or more semiconductor structures for coupling is also provided.

公开(公告)号：US20180090395A1

公开(公告)日：2018-03-29

申请号：US15830164

申请日：2017-12-04

申请人： Kulicke and Soffa Industries, Inc.

发明人： James E. Eder ,  David C. Schalcosky

IPC分类号： H01L21/66 ,  H01L23/544 ,  H01L23/00

CPC分类号： H01L22/20 ,  H01L23/544 ,  H01L24/75 ,  H01L24/81 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/75343 ,  H01L2224/75701 ,  H01L2224/75734 ,  H01L2224/75744 ,  H01L2224/75753 ,  H01L2224/75755 ,  H01L2224/81121 ,  H01L2224/8118 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2225/06513 ,  H01L2225/06593 ,  H01L2924/15311 ,  H01L2924/00014

摘要： A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure for supporting a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; an alignment structure including first alignment markings; an alignment element configured to be placed on the alignment structure using the bonding tool, the alignment element including second alignment markings; an imaging system configured to image relative positions of the first alignment markings and corresponding ones of the second alignment markings; and a computer system configured to provide an adjustment to a position of at least one of the bonding tool and the support structure during bonding of ones of the plurality of semiconductor elements to the substrate, the computer being configured to provide the adjustment at least partially based on the relative positions of the first alignment markings and the corresponding ones of the second alignment markings, the adjustment being specific to bonding of the ones of the plurality of semiconductor elements to a corresponding region of the substrate.

公开(公告)号：US09905530B2

公开(公告)日：2018-02-27

申请号：US15449466

申请日：2017-03-03

申请人： Kulicke and Soffa Industries, Inc.

发明人： Robert N. Chylak ,  Dominick A. DeAngelis

IPC分类号： H01L23/00 ,  H01L25/00 ,  H01L25/10 ,  H01L25/065

CPC分类号： H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L24/75 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/1134 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13624 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75343 ,  H01L2224/75348 ,  H01L2224/75349 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/759 ,  H01L2224/8112 ,  H01L2224/81121 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81207 ,  H01L2224/81409 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/818 ,  H01L2224/81801 ,  H01L2224/81895 ,  H01L2224/81906 ,  H01L2225/06513 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20301 ,  H01L2924/20302 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2924/20305 ,  H01L2924/20306 ,  H01L2924/20307 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/8121 ,  H01L2924/00

摘要： A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element, wherein the surfaces of each of the plurality of first conductive structures and the plurality of second conductive structures include aluminum; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures.

公开(公告)号：US20170330805A1

公开(公告)日：2017-11-16

申请号：US15388625

申请日：2016-12-22

申请人： Massachusetts Institute of Technology

发明人： Keith Warner ,  Richard P. D'Onofrio ,  Donna-Ruth W. Yost

IPC分类号： H01L21/66 ,  H01L23/00 ,  H01L27/06

CPC分类号： H01L22/20 ,  H01L21/6835 ,  H01L21/76898 ,  H01L21/8221 ,  H01L22/12 ,  H01L23/544 ,  H01L24/75 ,  H01L24/80 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L27/0688 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/80006 ,  H01L2224/8013 ,  H01L2224/80896 ,  H01L2224/8203 ,  H01L2224/821 ,  H01L2224/8313 ,  H01L2224/9222 ,  H01L2224/80001 ,  H01L2224/82

摘要： In a system for aligning at least two semiconductor structures for coupling, an alignment device includes a mounting structure having at least first and second opposing portions. The alignment device also includes a first mounting portion movably coupled to the first portion of the mounting structure, the first mounting portion configured to couple to a first surface of a first semiconductor structure. The alignment device additionally includes a second mounting portion movably coupled to the second portion of the mounting structure, the second mounting portion configured to couple to a second surface of a second semiconductor structure. The alignment device further includes one or more imaging devices disposed above at least one of the first and second mounting portions of the alignment device, the imaging devices configured to capture and/or or detect alignment marks in at least the first semiconductor structure. A corresponding method for aligning two or more semiconductor structures for coupling is also provided.

公开(公告)号：US20170186718A1

公开(公告)日：2017-06-29

申请号：US15368732

申请日：2016-12-05

申请人： FUJITSU LIMITED

发明人： Hidehiko Kira ,  Naoaki Nakamura ,  Sanae IIJIMA

IPC分类号： H01L23/00 ,  H01L23/367 ,  H01L21/683 ,  H01L23/29 ,  H01L25/00 ,  H01L21/78 ,  H01L25/065 ,  H01L23/31

CPC分类号： H01L24/17 ,  H01L21/56 ,  H01L21/6838 ,  H01L21/78 ,  H01L23/295 ,  H01L23/3142 ,  H01L23/3178 ,  H01L23/367 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/13023 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16113 ,  H01L2224/16148 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29387 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75152 ,  H01L2224/75252 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75981 ,  H01L2224/81007 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06589 ,  H01L2924/014 ,  H01L2924/04642 ,  H01L2924/05032 ,  H01L2924/0665 ,  H01L2924/0715 ,  H01L2924/10158 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2924/01047 ,  H01L2924/01029

摘要： An electronic device includes an electronic part including a first substrate having a group of first terminals over a first front surface and having a concavity in a back surface, a filler placed in the concavity, and a flat plate placed over the back surface with the filler therebetween, and further includes a second substrate disposed on the first front surface side of the first substrate and having a group of second terminals bonded to the group of first terminals over a second front surface opposite the first front surface. The filler and flat plate minimize deformation of the first substrate and variation in the distance between the group of first terminals and the group of second terminals caused by the deformation of the first substrate, which thereby reduces the occurrence of a failure in bonding together the group of first terminals and the group of second terminals.

公开(公告)号：US20170053889A1

公开(公告)日：2017-02-23

申请号：US15255111

申请日：2016-09-01

申请人： SHINKAWA LTD.

发明人： OSAMU KAKUTANI ,  HIDEHIRO TAZAWA ,  MASAHITO TUJI

IPC分类号： H01L23/00

CPC分类号： H01L24/741 ,  H01L24/75 ,  H01L2224/75651 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75804 ,  H01L2224/75841

摘要： Provided is a bonding apparatus including a table (52), a first reaction member (58A) and a second reaction member (58B), which are each provided movably in a Y axis direction with respect to a pedestal (41). The first and second reaction members are each configured to move in a direction opposite to the table in the Y axis direction when the table moves in the Y axis direction. As viewed in an X axis direction, the first and second reaction members are arranged on both sides of the table, respectively, with the table being interposed between the first and second reaction members, so that the centers of gravity of the first and second reaction members are positioned based on the center of gravity of the table. Consequently, the bonding apparatus can suppress an increase in space, and can improve a weight balance on the pedestal.

摘要翻译： 提供了一种接合装置，其包括相对于基座（41）沿Y轴方向可移动地设置的工作台（52），第一反作用部件（58A）和第二反作用部件（58B）。 第一反作用构件和第二反作用构件被构造成当工作台沿Y轴方向移动时沿与Y工作台相反的方向移动。 从X轴方向观察，第一反应构件和第二反应构件分别设置在工作台的两侧，工作台位于第一和第二反应构件之间，使得第一和第二反应的重心 构件基于桌子的重心定位。 因此，接合装置能够抑制空间的增加，能够提高基座上的重量平衡。

公开(公告)号：US09538582B2

公开(公告)日：2017-01-03

申请号：US13559318

申请日：2012-07-26

申请人： Ming-Da Cheng ,  Hsiu-Jen Lin ,  Cheng-Ting Chen ,  Wei-Yu Chen ,  Chien-Wei Lee ,  Chung-Shi Liu

发明人： Ming-Da Cheng ,  Hsiu-Jen Lin ,  Cheng-Ting Chen ,  Wei-Yu Chen ,  Chien-Wei Lee ,  Chung-Shi Liu

IPC分类号： B23K31/02 ,  H01L21/00 ,  H05B3/02 ,  H01L21/677 ,  H01L21/683 ,  H01L23/00

CPC分类号： H05B3/02 ,  B23K3/087 ,  B23K2101/40 ,  H01L21/67721 ,  H01L21/6838 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/75744 ,  H01L2224/7598 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/3511 ,  H01L2924/37001 ,  Y10T29/41 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2924/014

摘要： A method includes placing a first package component over a vacuum boat, wherein the vacuum boat comprises a hole, and wherein the first package component covers the hole. A second package component is placed over the first package component, wherein solder regions are disposed between the first and the second package components. The hole is vacuumed, wherein the first package component is pressed by a pressure against the vacuum boat, and wherein the pressure is generated by a vacuum in the hole. When the vacuum in the hole is maintained, the solder regions are reflowed to bond the second package component to the first package component.

摘要翻译： 一种方法包括将第一包装部件放置在真空舟皿上，其中真空舟皿包括孔，并且其中第一包装部件覆盖该孔。 第二包装部件放置在第一包装部件上，其中焊料区域设置在第一和第二包装部件之间。 该孔被抽真空，其中第一包装部件被压靠在真空舟皿上的压力，并且其中压力由孔中的真空产生。 当保持孔中的真空时，回流焊接区域以将第二包装部件结合到第一包装部件。