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公开(公告)号:US20230112270A1
公开(公告)日:2023-04-13
申请号:US17844968
申请日:2022-06-21
发明人: Jon W. Brunner , Gary W. Schulze , Aashish Shah
IPC分类号: B23K37/00
摘要: A method of installing a wire bonding tool on a wire bonding system is provided. The method includes the steps of: (a) holding a wire bonding tool with an installation tool; (b) engaging the wire bonding tool in an aperture of a transducer of a wire bonding system while the wire bonding tool is held by the installation tool; (c) securing the wire bonding tool in the aperture; and (d) releasing the wire bonding tool from the installation tool.