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公开(公告)号：US12113043B2
公开(公告)日：2024-10-08
申请号：US17987708
申请日：2022-11-15
发明人： Jon W. Brunner , Wei Qin , Aashish Shah , Hui Xu , Jeong Ho Yang
IPC分类号： B23K20/00 , B23K20/10 , H01L23/00 , B23K101/40
CPC分类号： H01L24/78 , B23K20/10 , B23K2101/40 , H01L2224/78001 , H01L2224/78343 , H01L2224/78901 , H01L2924/386
摘要： A method of calibrating an ultrasonic characteristic on a wire bonding system is provided. The method includes the steps of: (a) determining a reference ultrasonic characteristic for formation of a wire bond; (b) determining a reference non-stick ultrasonic characteristic that results in a non-stick wire bond condition; (c) determining a calibration non-stick ultrasonic characteristic, on a wire bonding system to be calibrated, that results in a non-stick wire bond condition; and (d) determining a calibration factor for the wire bonding system to be calibrated using the reference non-stick ultrasonic characteristic and the calibration non-stick ultrasonic characteristic.
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2.发明申请公开(公告)号：US20190027463A1
公开(公告)日：2019-01-24
申请号：US16142662
申请日：2018-09-26
IPC分类号： H01L23/00
摘要： A method of providing a z-axis force profile applied to a plurality of bonding locations during a wire bonding operation is provided. The method includes: (a) determining a z-axis force profile for each of a plurality of bonding locations on an unsupported portion of at least one reference semiconductor device; and (b) applying the z-axis force profile during subsequent bonding of a subject semiconductor device. Methods of: determining a maximum bond force applied to a bonding location during formation of a wire bond; and determining a z-axis constant velocity profile for formation of a wire bond, are also provided.
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公开(公告)号：US20230154888A1
公开(公告)日：2023-05-18
申请号：US17987708
申请日：2022-11-15
发明人： Jon W. Brunner , Wei Qin , Aashish Shah , Hui Xu , Jeong Ho Yang
CPC分类号： H01L24/78 , H01L24/85 , B23K20/10 , H01L24/48 , H01L2224/48221 , H01L2924/386 , H01L2224/78001 , H01L2224/78343 , H01L2224/78901 , H01L2224/7892 , H01L2224/78925 , H01L2224/85986 , H01L2224/859 , H01L2224/85205 , B23K2101/40
摘要： A method of calibrating an ultrasonic characteristic on a wire bonding system is provided. The method includes the steps of: (a) determining a reference ultrasonic characteristic for formation of a wire bond; (b) determining a reference non-stick ultrasonic characteristic that results in a non-stick wire bond condition; (c) determining a calibration non-stick ultrasonic characteristic, on a wire bonding system to be calibrated, that results in a non-stick wire bond condition; and (d) determining a calibration factor for the wire bonding system to be calibrated using the reference non-stick ultrasonic characteristic and the calibration non-stick ultrasonic characteristic.
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公开(公告)号：US10121759B2
公开(公告)日：2018-11-06
申请号：US15234563
申请日：2016-08-11
摘要： A method of providing a z-axis force profile applied to a plurality of bonding locations during a wire bonding operation is provided. The method includes: (a) determining a z-axis force profile for each of a plurality of bonding locations on an unsupported portion of at least one reference semiconductor device; and (b) applying the z-axis force profile during subsequent bonding of a subject semiconductor device. Methods of: determining a maximum bond force applied to a bonding location during formation of a wire bond; and determining a z-axis constant velocity profile for formation of a wire bond, are also provided.
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5.发明申请公开(公告)号：US20170125311A1
公开(公告)日：2017-05-04
申请号：US15234563
申请日：2016-08-11
CPC分类号： H01L24/78 , B23K20/005 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/92 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/48095 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/78001 , H01L2224/78901 , H01L2224/85181 , H01L2224/859 , H01L2224/92247 , H01L2924/00014 , H01L2224/05599 , H01L2224/45099 , H01L2924/00 , H01L2224/85399
摘要： A method of providing a z-axis force profile applied to a plurality of bonding locations during a wire bonding operation is provided. The method includes: (a) determining a z-axis force profile for each of a plurality of bonding locations on an unsupported portion of at least one reference semiconductor device; and (b) applying the z-axis force profile during subsequent bonding of a subject semiconductor device. Methods of: determining a maximum bond force applied to a bonding location during formation of a wire bond; and determining a z-axis constant velocity profile for formation of a wire bond, are also provided.
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公开(公告)号：US20230112270A1
公开(公告)日：2023-04-13
申请号：US17844968
申请日：2022-06-21
发明人： Jon W. Brunner , Gary W. Schulze , Aashish Shah
IPC分类号： B23K37/00
摘要： A method of installing a wire bonding tool on a wire bonding system is provided. The method includes the steps of: (a) holding a wire bonding tool with an installation tool; (b) engaging the wire bonding tool in an aperture of a transducer of a wire bonding system while the wire bonding tool is held by the installation tool; (c) securing the wire bonding tool in the aperture; and (d) releasing the wire bonding tool from the installation tool.
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公开(公告)号：US10665564B2
公开(公告)日：2020-05-26
申请号：US16142662
申请日：2018-09-26
IPC分类号： H01L23/49 , H01L23/00 , H01L25/065 , B23K20/00
摘要： A method of providing a z-axis force profile applied to a plurality of bonding locations during a wire bonding operation is provided. The method includes: (a) determining a z-axis force profile for each of a plurality of bonding locations on an unsupported portion of at least one reference semiconductor device; and (b) applying the z-axis force profile during subsequent bonding of a subject semiconductor device. Methods of: determining a maximum bond force applied to a bonding location during formation of a wire bond; and determining a z-axis constant velocity profile for formation of a wire bond, are also provided.
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