公开(公告)号：US07810698B2

公开(公告)日：2010-10-12

申请号：US12274410

申请日：2008-11-20

申请人： Kwok Kee Chung ,  Wing Hong Leung ,  Ka Fai Fung ,  Chi Leung Vincent Mok ,  Shun Ming Kenneth Fung

发明人： Kwok Kee Chung ,  Wing Hong Leung ,  Ka Fai Fung ,  Chi Leung Vincent Mok ,  Shun Ming Kenneth Fung

IPC分类号： B23K20/00 ,  B23K37/00

CPC分类号： G05B19/4015 ,  G05B2219/37559 ,  G05B2219/45033 ,  H01L2924/0002 ,  H01L2924/00

摘要： An apparatus for correcting a positional offset of a bonding tool during bonding operations comprises a first fiducial mark and a second fiducial mark spaced from the first fiducial mark located on the bonding tool. A first imaging path emanates from the first fiducial mark and a second imaging path emanates from the second fiducial mark when the first and second fiducial marks are illuminated at a reference position. An optical system is positioned along the first and second imaging paths to view images of the first and second fiducial marks. A processor is operative to calculate a current position of the bonding tool and to compare it to a desired position so that the bonding tool's positional offset may be corrected by moving it to the desired position.

摘要翻译： 用于在接合操作期间校正接合工具的位置偏移的装置包括与位于接合工具上的第一基准标记间隔开的第一基准标记和第二基准标记。 当第一和第二基准标记在参考位置被照亮时，第一成像路径从第一基准标记发出并且第二成像路径从第二基准标记发出。 沿着第一和第二成像路径定位光学系统以观看第一和第二基准标记的图像。 处理器可操作以计算接合工具的当前位置并将其与期望位置进行比较，使得可以通过将接合工具的位置偏移移动到期望位置来校正接合工具的位置偏移。