公开(公告)号：US11282737B2

公开(公告)日：2022-03-22

申请号：US16969857

申请日：2019-02-15

Applicant: LAM RESEARCH CORPORATION

Inventor： Daniel Arthur Brown ,  Leonard John Sharpless ,  Allan Kent Ronne ,  Christopher William Burkhart

IPC: H01L21/677 ,  H01L21/687 ,  H01L21/683

Abstract: A substrate processing tool includes a plurality of process modules configured to process a semiconductor substrate. Each of the plurality of process modules is arranged at a different location within the substrate processing tool. A vacuum transfer module (VTM) includes a robot and is configured to move between a plurality of different positions corresponding to the different locations within the substrate processing tool to allow the robot to access respective ones of the plurality of process modules.