公开(公告)号：US10483142B1

公开(公告)日：2019-11-19

申请号：US16132326

申请日：2018-09-14

Applicant: Lam Research Corporation

Inventor： Mark K. Tan ,  Christopher William Burkhart ,  Richard M. Blank ,  Richard H. Gould

IPC: H01L21/677 ,  H01L21/687 ,  H01L21/67 ,  H01L21/68

Abstract: A system for mounting vacuum robot arms in horizontally elongate vacuum transfer modules is provided. The system provides mechanical isolation to the vacuum robot arm against deflections in the housing of the vacuum transfer module due to depressurization of the interior of the vacuum transfer module while the exterior of the vacuum transfer module is subjected to atmospheric pressure. Such systems may prevent undesirable, larger displacements of the end effector of such vacuum robot arms due to the deflection.

公开(公告)号：US10215317B2

公开(公告)日：2019-02-26

申请号：US15087889

申请日：2016-03-31

Applicant: Lam Research Corporation

Inventor： Christopher William Burkhart ,  Andrew C. Lee ,  David J. Hemker

IPC: F16L25/00 ,  F16L23/14 ,  H01L21/67 ,  B33Y10/00 ,  B22F7/04 ,  F16L9/00 ,  F16L13/00 ,  F16L47/14 ,  F16L3/00 ,  F16L51/02 ,  F16L43/00 ,  F16L41/02 ,  B33Y80/00 ,  B22F3/00 ,  B22F3/105

Abstract: Methods and apparatuses for additively manufactured tubular passages, additively manufactured manifolds, and additively manufactured heaters are provided.

公开(公告)号：US09879795B2

公开(公告)日：2018-01-30

申请号：US14997419

申请日：2016-01-15

Applicant: Lam Research Corporation

Inventor： Christopher William Burkhart ,  Andrew C. Lee

IPC: F16K11/00 ,  F16K27/00 ,  F17D1/00 ,  H01J37/32 ,  C23C16/455 ,  B33Y80/00

CPC classification number: F16K27/003 ,  B33Y80/00 ,  C23C16/45561 ,  F16K19/00 ,  F17D1/00 ,  H01J37/3244 ,  H01J37/32449 ,  Y10T137/87249 ,  Y10T137/87652 ,  Y10T137/87684 ,  Y10T137/87885

Abstract: A manifold constructed by additive manufacturing for use in semiconductor processing tools is provided. The manifold may include a mixing chamber and portions of a plurality of flow paths with each flow path including a first fluid flow component interface, a second fluid flow component interface, a first tubular passage fluidically connecting the first mixing chamber with a first fluid flow component interface outlet of that flow path, and a second tubular passage fluidically connecting a first fluid flow component interface inlet of that flow path with a second fluid flow component interface outlet of that flow path. Each fluid flow component interface is configured to interface with a corresponding fluid flow component such that the corresponding fluid flow component, when installed, is able to interact with fluid flow between the fluid flow component interface inlet and the fluid flow component interface outlet.

公开(公告)号：US11282737B2

公开(公告)日：2022-03-22

申请号：US16969857

申请日：2019-02-15

Applicant: LAM RESEARCH CORPORATION

Inventor： Daniel Arthur Brown ,  Leonard John Sharpless ,  Allan Kent Ronne ,  Christopher William Burkhart

IPC: H01L21/677 ,  H01L21/687 ,  H01L21/683

Abstract: A substrate processing tool includes a plurality of process modules configured to process a semiconductor substrate. Each of the plurality of process modules is arranged at a different location within the substrate processing tool. A vacuum transfer module (VTM) includes a robot and is configured to move between a plurality of different positions corresponding to the different locations within the substrate processing tool to allow the robot to access respective ones of the plurality of process modules.

公开(公告)号：US10794519B2

公开(公告)日：2020-10-06

申请号：US16241811

申请日：2019-01-07

Applicant: Lam Research Corporation

Inventor： Christopher William Burkhart ,  Andrew C. Lee ,  David J. Hemker

IPC: F16L25/00 ,  H01L21/67 ,  B33Y10/00 ,  B22F7/04 ,  F16L9/00 ,  F16L13/00 ,  F16L47/14 ,  F16L3/00 ,  F16L51/02 ,  F16L23/14 ,  F16L43/00 ,  F16L41/02 ,  F16K11/00 ,  H01J37/32 ,  B01F15/04 ,  F16K27/00 ,  C23C16/455 ,  B33Y80/00 ,  B22F3/00 ,  B22F3/105

Abstract: Methods and apparatuses for additively manufactured tubular passages, additively manufactured manifolds, and additively manufactured heaters are provided.

公开(公告)号：US20190211955A1

公开(公告)日：2019-07-11

申请号：US16241811

申请日：2019-01-07

Applicant: Lam Research Corporation

Inventor： Christopher William Burkhart ,  Andrew C. Lee ,  David J. Hemker

IPC: F16L25/00 ,  B22F7/04 ,  H01L21/67 ,  F16L9/00 ,  F16L13/00 ,  F16L51/02 ,  F16L47/14 ,  F16L3/00 ,  F16L41/02 ,  F16L43/00 ,  F16L23/14 ,  B33Y10/00

Abstract: Methods and apparatuses for additively manufactured tubular passages, additively manufactured manifolds, and additively manufactured heaters are provided.

公开(公告)号：US20170204989A1

公开(公告)日：2017-07-20

申请号：US14997419

申请日：2016-01-15

Applicant: Lam Research Corporation

Inventor： Christopher William Burkhart ,  Andrew C. Lee

IPC: F16K31/48 ,  B33Y80/00

CPC classification number: F16K27/003 ,  B33Y80/00 ,  C23C16/45561 ,  F16K19/00 ,  F17D1/00 ,  H01J37/3244 ,  H01J37/32449 ,  Y10T137/87249 ,  Y10T137/87652 ,  Y10T137/87684 ,  Y10T137/87885

Abstract: A manifold constructed by additive manufacturing for use in semiconductor processing tools is provided. The manifold may include a mixing chamber and portions of a plurality of flow paths with each flow path including a first fluid flow component interface, a second fluid flow component interface, a first tubular passage fluidically connecting the first mixing chamber with a first fluid flow component interface outlet of that flow path, and a second tubular passage fluidically connecting a first fluid flow component interface inlet of that flow path with a second fluid flow component interface outlet of that flow path. Each fluid flow component interface is configured to interface with a corresponding fluid flow component such that the corresponding fluid flow component, when installed, is able to interact with fluid flow between the fluid flow component interface inlet and the fluid flow component interface outlet.

公开(公告)号：US20170203511A1

公开(公告)日：2017-07-20

申请号：US15087889

申请日：2016-03-31

Applicant: Lam Research Corporation

Inventor： Christopher William Burkhart ,  Andrew C. Lee ,  David J. Hemker

IPC: B29C67/00 ,  B28B1/00 ,  B22F7/04 ,  B33Y50/02 ,  B33Y80/00 ,  H01L21/67 ,  B33Y10/00

CPC classification number: F16L25/0009 ,  B22F3/008 ,  B22F3/1055 ,  B22F7/04 ,  B29K2995/0006 ,  B33Y10/00 ,  B33Y80/00 ,  F16L3/006 ,  F16L9/003 ,  F16L13/002 ,  F16L23/14 ,  F16L41/025 ,  F16L43/003 ,  F16L47/145 ,  F16L51/021 ,  H01L21/67017 ,  H01L21/6719 ,  H05B2203/021 ,  Y02P10/295 ,  Y10T137/6606 ,  Y10T137/87571 ,  Y10T137/87684

Abstract: Methods and apparatuses for additively manufactured tubular passages, additively manufactured manifolds, and additively manufactured heaters are provided.